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公开(公告)号：WO2020171990A1
公开(公告)日：2020-08-27
申请号：PCT/US2020/017403
申请日：2020-02-10
Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC
Inventor： YE, Maosheng , YANEZ, Javier , HOLLOWAY, Frank, C. , BEERMAN, Michael , RICCOMINI, Roy, Joseph
IPC: B29C45/00 , G02B27/01 , G02C5/00 , G02C5/02 , B29L11/00 , B29K69/00 , B29C45/16 , B29L12/00 , G01S7/481
Abstract: A method of making an integrated depth sensor window lens (114, 214, 314, 414, 840), such as for an augmented reality (AR) head set, the depth sensor window lens (114, 214, 314, 414, 840) comprising a sensor lens (116, 216, 316, 416, 516) and an illuminator lens (118, 218, 318, 418, 518) separated by an opaque dam (117, 217, 317, 417, 517). The method uses a two-shot injection molding process, a first shot comprising an optically clear polymeric material to form the sensor lens (116, 216, 316, 416, 516) and the illuminator lens (118, 218, 318, 418, 518) and the second shot comprising an opaque polymeric material to form the separator of the two.
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公开(公告)号：WO2016118387A1
公开(公告)日：2016-07-28
申请号：PCT/US2016/013308
申请日：2016-01-14
Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC
Inventor： NIKKHOO, Michael , HEIRICH, Doug , RICCOMINI, Roy , YE, Maosheng , BEERMAN, Michael , HODGE, Andrew
CPC classification number: H05K7/20963 , F28D15/00 , F28D15/02 , F28D15/0241 , F28F3/02 , F28F3/08 , F28F21/00 , F28F21/02 , F28F21/08 , F28F21/085 , F28F2255/02 , G02B27/0176 , G02B2027/0178 , G06F1/163 , G06F1/1681 , G06F1/203 , G06F3/011 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L2023/4068 , H05K1/0201 , H05K5/0226 , H05K7/20127 , H05K7/2039 , H05K7/20409 , H05K7/20454
Abstract: A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.
Abstract translation: 柔性热导管从电子设备的第一壳体部分延伸到电子设备的第二壳体部分，以将位于第一壳体部分中的电子部件产生的热量传递到位于第二壳体部分中的散热结构， 其中第二壳体部分例如通过铰链或其它类型的接头柔性地联接到第一壳体部分。 柔性导管可以包括多层薄的平坦的导热材料，其可被布置成在第一和第二壳体部分联接的区域中彼此独立地弯曲。
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公开(公告)号：WO2016118311A1
公开(公告)日：2016-07-28
申请号：PCT/US2016/012012
申请日：2016-01-04
Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC
Inventor： NIKKHOO, Michael , HEIRICH, Doug , RICCOMINI, Roy , YE, Maosheng , BEERMAN, Michael , TAYLOR, Joseph, Daniel
CPC classification number: H05K7/20963 , F28D15/00 , F28D15/02 , F28D15/0241 , F28F3/02 , F28F3/08 , F28F21/00 , F28F21/02 , F28F21/08 , F28F21/085 , F28F2255/02 , G02B27/0176 , G02B2027/0178 , G06F1/163 , G06F1/1681 , G06F1/203 , G06F3/011 , H01L23/3733 , H01L23/3735 , H01L23/3736 , H01L2023/4068 , H05K1/0201 , H05K5/0226 , H05K7/20127 , H05K7/2039 , H05K7/20409 , H05K7/20454
Abstract: A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.
Abstract translation: 柔性热导管从电子设备的第一壳体部分延伸到电子设备的第二壳体部分，以将位于第一壳体部分中的电子部件产生的热量传递到位于第二壳体部分中的散热结构， 其中第二壳体部分例如通过铰链或其它类型的接头柔性地联接到第一壳体部分。 柔性导管可以包括多层薄的平坦导热材料，其可被布置为在第一和第二壳体部分联接的区域中彼此独立地弯曲。
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