公开(公告)号：WO2006065221A1

公开(公告)日：2006-06-22

申请号：PCT/SE2005/001930

申请日：2005-12-13

Applicant: POLYMER KOMPOSITER I GÖTEBORG AB ,  REMGÅRD, Anders

Inventor： REMGÅRD, Anders

IPC: C23C18/31 ,  C23C18/42 ,  C23C18/44

CPC classification number: C23C18/1675 ,  C23C18/1601 ,  C23C18/1651 ,  C23C18/1882 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/54 ,  Y10T428/31678

Abstract: Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for coating silver metal is also described. A method for autocatalytic plating of silver metal directly onto a silicon surface without the need for an intervening layer of metal is also disclosed. The deposits of silver obtained are uniform, non-porous and have electrical properties . The technique can be applied for different processes and bath formulations i.e. different metals, complexing agents and reducing agents .

Abstract translation: 公开了一种使用自动催化无电镀浴的金属镀金属基板的方法，其中所述镀液在其浊点温度以上运行，使得至少两相存在于镀液中。 还描述了用于涂覆银金属的自催化无电镀浴。 还公开了一种将银金属直接自动电镀到硅表面上而不需要中间金属层的方法。 获得的银的沉积物是均匀的，无孔的并且具有电性能。 该技术可以应用于不同的方法和浴制剂，即不同的金属，络合剂和还原剂。

公开(公告)号：WO2006065220A1

公开(公告)日：2006-06-22

申请号：PCT/SE2005/001928

申请日：2005-12-14

Applicant: POLYMER KOMPOSITER I GÖTEBORG AB ,  REMGÅRD, Anders

Inventor： REMGÅRD, Anders

IPC: C25D5/18

CPC classification number: C25D5/18

Abstract: The present invention provides a method for plating an object with a metal coating, allowing uniform coatings to be applied, even inside cavities in the object. The method comprises the steps of: bringing the object into contact with a solution comprising metal ions; bringing a counter electrode into contact with said solution comprising metal ions; connecting an electrical circuit between the object and the counter electrode; applying a constant DC current I1 to the electrical circuit for a time period t-, so as to provide a current density A-i on the surface of the object so that the object becomes plated with a metal coating; applying a second constant DC current I2 in the opposite direction as I1 to the electrical circuit for a time period t2 so as to provide a current density A2 on the surface of the object; applying a third constant DC current I3 in the same direction as Ii to the electrical circuit for a time period t3 so as to provide a current density A3 on the surface of the object. The plating steps may be repeated until the object is plated with the required profile of the metal. The invention further relates to an object plated according to the described method, and to an apparatus for carrying out the method. The invention also relates to the pulse sequence of the described method, and a set of instructions for carrying out the pulse sequence of the described method.

Abstract translation: 本发明提供了一种用金属涂层对物体进行电镀的方法，即使在物体的腔内也能施加均匀的涂层。 该方法包括以下步骤：使物体与包含金属离子的溶液接触; 使对电极与包含金属离子的所述溶液接触; 连接物体和对电极之间的电路; 在电路上施加恒定的直流电流I1至一个时间段t，以便在物体的表面上提供电流密度A-i，使得物体被镀金属涂层; 将与I1相反方向的第二恒定DC电流I2施加到电路一段时间t2，以便在物体的表面上提供电流密度A2; 将与Ii相同方向的第三恒定DC电流I3施加到电路一段时间t3，以便在物体的表面上提供电流密度A3。 可以重复电镀步骤，直到对象被镀有所需的金属型材。 本发明还涉及根据所述方法镀覆的物体，以及用于执行该方法的装置。 本发明还涉及所述方法的脉冲序列，以及用于执行所述方法的脉冲序列的一组指令。