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1.发明申请
公开(公告)号：WO2021040868A1
公开(公告)日：2021-03-04
申请号：PCT/US2020/039142
申请日：2020-06-23
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： KRILEY, Joseph P. , POLLUM, JR., Marvin M. , FORTMAN, David J. , REARICK, Brian K. , NAKAJIMA, Masayuki , BROWN-TSENG, Elizabeh S. , BOWLES, Steven E. , FRENCH, Maria S.
IPC: C23C22/34 , C23C22/83 , C23G1/02 , C23G1/12 , B05D3/10 , C09D5/08 , C08G59/18 , C09D163/00 , C09J163/00 , C09J5/02
Abstract: Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a homopolymer or copolymer comprising a phosphorous-containing monomeric subunit, and has a pH of 1.0 to 3.0. The coating composition comprises first and second components and elastomeric particles. The first component comprises an epoxy-containing compound (E1) and/or an epoxide-functional adduct (E2). The second component comprises a diamine and/or a polyamine comprising a cyclic ring (A2) and/or an amine-functional adduct (A3). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.
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公开(公告)号：WO2021173941A1
公开(公告)日：2021-09-02
申请号：PCT/US2021/019831
申请日：2021-02-26
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , MUNRO, Calum H. , POLLUM, JR., Marvin M. , DEI, Daniel K. , WOODWORTH, Brian E. , SCHNEIDER, John R. , FRENCH, Maria S. , CONDIE, Allison G. , GONDER-JONES, Holli , APANIUS, Christopher , BANCROFT, Cassandra Noelle
IPC: C09D5/03 , C09D163/00 , B05D1/06 , C09D171/12
Abstract: The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.
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公开(公告)号：WO2020077333A1
公开(公告)日：2020-04-16
申请号：PCT/US2019/056080
申请日：2019-10-14
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , CONDIE, Allison G. , POLLUM, JR., Marvin M. , HSU, Lorraine , FRENCH, Maria S. , MUNRO, Calum H. , FANG, Shuyu , NAKAJIMA, Masayuki
Abstract: Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω•m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90 % by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10 % by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
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公开(公告)号：WO2021040867A1
公开(公告)日：2021-03-04
申请号：PCT/US2020/039130
申请日：2020-06-23
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： KRILEY, Joseph P. , POLLUM, JR., Marvin M. , FORTMAN, David J. , REARICK, Brian K. , NAKAJIMA, Masayuki , FRENCH, Maria S.
IPC: C08G59/18 , C08G59/50 , C09D163/00 , C09J163/00
Abstract: Disclosed is an epoxide-functional adduct (E2) and an amine-functional adduct (A3) and coating compositions including these adducts. The epoxide-functional adduct (E2) comprises a reaction product of a reaction mixture comprising (a) an epoxy-containing compound (E1) and (b) a diamine comprising a cyclic ring and/or a polyamine comprising a cyclic ring (A1). The amine-functional adduct comprises a reaction product of a reaction mixture comprising the epoxy-functional adduct (E2) and a monoamine, diamine, and/or polyamine (A2), wherein the monoamine, diamine, and/or polyamine (A2) are different than the diamine comprising a cyclic ring and/or the polyamine comprising a cyclic ring (A1). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.
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5.发明申请
公开(公告)号：WO2021040865A1
公开(公告)日：2021-03-04
申请号：PCT/US2020/039060
申请日：2020-06-23
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： FORTMAN, David J. , POLLUM, JR., Marvin M. , KRILEY, Joseph P. , REARICK, Brian K. , FRENCH, Maria S. , BROWN-TSENG, Elizabeth S. , BOWLES, Steven E.
IPC: C08G59/50 , C08L63/00 , C09D163/00 , C09J163/00 , C23C22/34 , C23C22/83 , C23G1/02
Abstract: Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a homopolymer or copolymer comprising a phosphorous-containing monomeric subunit, and has a pH of 1.0 to 3.0. The coating composition comprises first and second components and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine and/or a polyamine comprising a cyclic ring. The diamine may chemically react with the epoxy-containing compound. The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.
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Patent Agency Ranking
公开(公告)号：WO2021211185A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/014135
申请日：2021-01-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , CONDIE, Allison G. , POLLUM, JR., Marvin M. , FRENCH, Maria S. , HSU, Lorraine , FANG, Shuyu , LI, Hong , MUNRO, Calum H. , KUTCHKO, Cynthia , EPSTEIN, Eric S. , SAHA, Gobinda
Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m-K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ωm (measured according to ASTM D257, C611, or B 193) and that may be present in an amount of at least 50 % by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10 % by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
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公开(公告)号：WO2021211183A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/014085
申请日：2021-01-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , POLLUM, JR., Marvin M. , MUNRO, Calum H. , FRENCH, Maria S. , CONDIE, Allison G. , MEZZANOTTI, Fabien , LÉON, Josiane , LI, Hong
IPC: C08K3/22 , H01M10/60 , H05K1/02 , H01M10/613 , H01M10/625 , H01M10/653 , H05K3/28
Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m.K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.
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公开(公告)号：WO2021119419A1
公开(公告)日：2021-06-17
申请号：PCT/US2020/064499
申请日：2020-12-11
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , HSU, Lorraine , CONDIE, Allison G. , POLLUM, JR., Marvin M. , FRENCH, Maria S.
Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15 % by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.
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公开(公告)号：WO2021211694A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/027252
申请日：2021-04-14
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , CONDIE, Allison G. , POLLUM, JR., Marvin M. , FRENCH, Maria S. , HSU, Lorraine , FANG, Shuyu , LI, Hong , MUNRO, Calum H. , KUTCHKO, Cynthia , EPSTEIN, Eric S. , SAHA, Gobinda
Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50 % by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10 % by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
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公开(公告)号：WO2021211182A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/014073
申请日：2021-01-20
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： MA, Liang , POLLUM, JR., Marvin M. , NAKAJIMA, Masayuki , WILLIS, Daniel P. , HSU, Lorraine , CONDIE, Allison G. , FRENCH, Maria S. , ZHOU, Hongying , ZHENG, Qi , LI, Hong , MUNRO, Calum H.
Abstract: Disclosed herein is a moisture -curable composition. The composition includes a hydroly sable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/mK (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.
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