公开(公告)号：WO2019150100A1

公开(公告)日：2019-08-08

申请号：PCT/GB2019/050250

申请日：2019-01-30

Applicant: PRAGMATIC PRINTING LTD.

Inventor： PRICE, Richard David ,  DAVIES, Neil ,  WHITE, Scott ,  VAN DEN HEEVER, Thomas Stanley ,  WILLIAMSON, Kenneth David ,  GREEN, Nathaniel James

IPC: H01L21/67 ,  H01L21/677

Abstract: The invention relates to a system for manufacturing a plurality of integrated circuits, IC, mounted on a common support, the system comprising: an input station configured (adapted, arranged) to receive at least one common support; an output station configured (adapted, arranged) to receive at least one common support having a plurality of integrated circuits formed thereon; a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the processing steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the common support; a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween; control means (e.g. a control system, or at least one controller, control unit, or control module) operable to direct the at least one common support from the input station to the output station through one or more of the plurality of processing modules according to at least one processing protocol comprising a selected one of a plurality of changeable pre-programmed protocols; the control means being operable to direct the movement of a common support from the input station to the output station and through one or more of the processing modules independently of any other common support. The invention also relates to a method for manufacturing a plurality of integrated circuits, IC, mounted on a common support.

公开(公告)号：WO2013121195A1

公开(公告)日：2013-08-22

申请号：PCT/GB2013/050337

申请日：2013-02-13

Applicant: PRAGMATIC PRINTING LTD

Inventor： GREGORY, John James ,  PRICE, Richard David

IPC: H01L29/66 ,  H01L27/12

CPC classification number: H01L29/66477 ,  G03F7/2022 ,  H01L27/1266 ,  H01L29/66757 ,  H01L29/66765 ,  H01L29/66969

Abstract: A method of manufacturing an electronic device comprising a first terminal (e.g. a source terminal), a second terminal (e.g. a drain terminal), a semiconductor channel connecting the first and second terminals and a gate terminal to which a potential may be applied to control a conductivity of the channel. The method comprises a first exposure of a photoresist from above the substrate using a mask and a second exposure from below the substrate, wherein in the second exposure the first and second terminals shield a part of the photoresist from exposure. An intermediate step reduces the solubility of the photoresist exposed in the first exposure. A window is formed in the photoresist at the location which was shielded by the mask, but exposed to radiation from below. Semiconductor material, dielectric material and conductor material are deposited inside the window to form a semiconductor channel, gate dielectric, and a gate terminal, respectively.

Abstract translation: 一种制造电子器件的方法，包括第一端子（例如源极端子），第二端子（例如漏极端子），连接第一和第二端子的半导体沟道和可以施加电位的栅极端子以控制 通道的电导率。 该方法包括使用掩模从衬底上方首先曝光光致抗蚀剂，并从衬底下方第二曝光，其中在第二曝光中，第一和第二端子屏蔽光刻胶的一部分不被曝光。 中间步骤降低了在第一次曝光中暴露的光致抗蚀剂的溶解度。 在被掩模遮蔽的位置处的光致抗蚀剂中形成窗口，但是暴露于下方的辐射。 半导体材料，电介质材料和导体材料沉积在窗口内，分别形成半导体沟道，栅极电介质和栅极端子。

公开(公告)号：WO2017141013A1

公开(公告)日：2017-08-24

申请号：PCT/GB2017/050330

申请日：2017-02-09

Applicant: PRAGMATIC PRINTING LTD.

Inventor： DAVIES, Neil ,  PRICE, Richard David ,  DEVENPORT, Stephen ,  SPEAKMAN, Stuart, Philip

IPC: H01L21/67 ,  H01L21/60

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/75601 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75651 ,  H01L2224/7598 ,  H01L2224/81192 ,  H01L2224/95115 ,  H01L2224/97 ,  H01L2924/00014

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

Abstract translation: 公开了一种制造多个电子电路的方法。 每个电子电路包括相应的第一部分和相应的集成电路IC，所述相应的第一部分包括相应的一组接触垫，所述相应的集成电路IC包括相应的端子组并且安装在相应的接触垫组上，每个端子与相应的接触部电接触 垫。 该方法包括：提供包括多个第一部分的第一结构; 提供包括所述多个IC的第二结构和布置成支持所述多个IC的公共支撑; 将所述IC从所述公共支撑件转移到第一辊上; 将所述IC从所述第一辊转移到第二辊上; 以及将所述IC从所述第二辊转移到所述第一结构上，使得每组端子安装在相应的一组接触垫上。