公开(公告)号：WO1987005547A2

公开(公告)日：1987-09-24

申请号：PCT/US1987000530

申请日：1987-03-11

Applicant: RAYCHEM CORPORATION

Inventor： RAYCHEM CORPORATION ,  NOEL, Raymond ,  ROBINSON, William, M. ,  CHERLAN, Gabe ,  CLIFFORD, Thomas, H. ,  CARLOMAGNO, William, D. ,  DEASY, William, M. ,  GRASSAUER, Willie, K. ,  HAYGOOD, David, K. ,  SHERLOCK, H., Paul ,  WHITE, Harry, E.

IPC: B23K03/06

CPC classification number: H05K3/3478 ,  B23K3/06 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0113 ,  H05K2203/0235 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0726

Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.