公开(公告)号：WO2009029209A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/009983

申请日：2008-08-22

Applicant: CTS CORPORATION

Inventor： MCCRACKEN, Jeffrey ,  KNECHT, Thomas

IPC: H03L1/04 ,  H03L1/02 ,  H03B5/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including a ball grid array substrate seated on a circuit board, a heater and a temperature sensor mounted on the ball grid array substrate, and a crystal package mounted to the ball grid array substrate and overlying at least the heater. A layer of thermally conductive epoxy or adhesive material couples the heater to the crystal package. Stabilizer posts, which are made of an insulative adhesive or epoxy material, are formed between the ball grid array substrate and the circuit board for stabilizing and relieving the stress on the ball grid array substrate. A lid is seated on the circuit board and covers and defines an oven for the ball grid array substrate.

Abstract translation: 包括安置在电路板上的球栅阵列基板，安装在球栅阵列基板上的加热器和温度传感器的加热振荡器封装以及安装到球栅阵列基板并至少覆盖加热器的晶体封装。 一层导热环氧树脂或粘合剂材料将加热器与晶体封装相结合。 在球栅阵列基板和电路板之间形成由绝缘粘合剂或环氧材料制成的稳定柱，用于稳定和减轻球栅阵列基板上的应力。 盖子安置在电路板上并覆盖并限定了用于球栅阵列基板的烘箱。

公开(公告)号：WO00033096A1

公开(公告)日：2000-06-08

申请号：PCT/US1999/028746

申请日：1999-12-02

IPC: G01R31/26 ,  B23K20/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.

Abstract translation: 提供了用于使电子部件与凸起的接触元件接触的探针卡。 特别地，本发明对于使半导体晶片与诸如弹簧的弹性接触元件接触是有用的。 探针卡被设计成具有与晶片上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器被制备成具有一侧的接触柱和相对侧上的端子。 具有弹簧触点的插入件将空间变压器的相对侧上的触点连接到探针卡上的对应端子，该端子又连接到可连接到诸如常规测试器的测试装置的端子。

公开(公告)号：WO8809599A3

公开(公告)日：1988-12-29

申请号：PCT/US8801668

申请日：1988-05-16

Applicant: CRAY RESEARCH INC

Inventor： CRAY SEYMOUR R ,  KRAJEWSKY NICHOLAS J

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/50 ,  H01R12/52 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/14 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).

Abstract translation: 一种使用几乎纯粹的软退火金在互穿电镀孔内机械压缩的互连电子电路的方法和装置。 本发明的应用是将集成电路小片直接连接到电路板，方法是将金线球焊到集成电路小片的焊盘上，使其与小片表面基本垂直，并将金导线插入到 一旦引线在贯通的镀孔内被压缩，电路板提供电连接和机械连接。 本发明还发现其应用于夹层电路板组件的互连，其中软金引线被插入电路板的轴向对齐的通孔电镀孔中并且被压缩，使得保持引线在通孔电镀孔内压缩和弯曲 ，在电路板之间形成电连接。

公开(公告)号：WO1987005547A2

公开(公告)日：1987-09-24

申请号：PCT/US1987000530

申请日：1987-03-11

Applicant: RAYCHEM CORPORATION

Inventor： RAYCHEM CORPORATION ,  NOEL, Raymond ,  ROBINSON, William, M. ,  CHERLAN, Gabe ,  CLIFFORD, Thomas, H. ,  CARLOMAGNO, William, D. ,  DEASY, William, M. ,  GRASSAUER, Willie, K. ,  HAYGOOD, David, K. ,  SHERLOCK, H., Paul ,  WHITE, Harry, E.

IPC: B23K03/06

CPC classification number: H05K3/3478 ,  B23K3/06 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0125 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0113 ,  H05K2203/0235 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0726

Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

公开(公告)号：WO2009029226A1

公开(公告)日：2009-03-05

申请号：PCT/US2008/010017

申请日：2008-08-22

Applicant: CTS CORPORATION

Inventor： MCCRACKEN, Jeffrey

IPC: H03L1/04 ,  H03L1/02 ,  H03B5/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：WO1996013966A1

公开(公告)日：1996-05-09

申请号：PCT/DE1995001485

申请日：1995-10-25

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  BRAKUS, Bogdan

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H05K01/14

CPC classification number: H02M3/00 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/3421 ,  H05K2201/10946

Abstract: A current supply module is disclosed for mounting on a component-carrying printed circuit board in which individual elements are arranged on a modular printed circuit board. In order to economically produce such a current supply module and to solve in a reliable manner heat dissipation problems, the active components of the module are mounted in an open configuration on a ceramic plate produced by thick film technology. The module is mounted with its component face facing the component-carrying printed circuit board or is mounted within an opening in the printed circuit board, thus achieving reliable heat dissipation with low overall height.

Abstract translation: 本发明涉及一种电源模块，其用于装备一个印刷电路板组件，其中，所述单独的元件被布置在一个模块的印刷电路板。 为了生产这种以低成本且可靠的解决散热问题的电源模块，所述模块的所述活性组分在一种开式设计安装在厚膜技术陶瓷板A来制备。 该模块被安装到朝向或在印刷电路板组件的突破在低高度，以实现可靠的散热内印刷电路板组件的元件侧。

公开(公告)号：WO1995014314A1

公开(公告)日：1995-05-26

申请号：PCT/US1994013373

申请日：1994-11-16

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01R09/00

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件（102）和由所述电子部件（102）承载且可在所述表面处接近的导电接触端子（103）。 接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合， 而不使用单独的粘合材料。 提供导电外壳（116）并且由至少一层导电材料形成，该导电材料包围细长构件（106），并形成与紧邻第一紧密接合点的导电接触端子的至少一部分的第二紧密接合 。

公开(公告)号：WO1992005592A1

公开(公告)日：1992-04-02

申请号：PCT/US1991006668

申请日：1991-09-13

Applicant: MOTOROLA, INC.

Inventor： MOTOROLA, INC. ,  KNECHT, Thomas, A. ,  ACHILLE, Jean-Robert

IPC: H01L41/04

CPC classification number: H05K3/3426 ,  H01L41/053 ,  H05K2201/10083 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49204 ,  Y10T428/12375 ,  Y10T428/1241 ,  Y10T428/24008

Abstract: A piezoelectric component-mounting foil and foil making method are disclosed, whereby a first portion (102) of the foil in a first plane substantially parallel to a second portion (124) of the foil in a second plane are connected by a central portion (108) not in the first or second plane, the central portion (108) having at least one width dimension (120) of the central portion (108) less than at least one length dimension (122) of the central portion (108). A conductive foil material, appropriate thickness, overall geometry, and if desired, appropriate notch configuration are selected for a desired implementation of the foil for conductively attaching and at least partially supporting at least one piezoelectric component (904) such as a quartz crystal.

Abstract translation: 公开了一种压电元件安装箔和箔制造方法，由此在第二平面中基本上平行于箔的第二部分（124）的第一平面中的箔的第一部分（102）通过中心部分（ 108）不在第一或第二平面中，中心部分（108）具有中心部分（108）的至少一个宽度尺寸（120）小于中心部分（108）的至少一个长度尺寸（122）。 选择合适的厚度，整体几何形状以及如果需要的适当的凹口构型用于箔的所需实现，用于导电地附接和至少部分地支撑至少一个诸如石英晶体的压电元件（904）。

公开(公告)号：WO1990013992A1

公开(公告)日：1990-11-15

申请号：PCT/US1990002456

申请日：1990-05-03

Applicant: CRAY COMPUTER CORPORATION

Inventor： CRAY COMPUTER CORPORATION ,  CRAY, Seymour, R. ,  KRAZEWSKI, Nicholas, J.

IPC: H05K03/36

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4943 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49126 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757

Abstract: A method and apparatus for interconnecting electronic circuit boards (212, 214, 219, 221) through the use of twisted wire jumpers (231) which are formed from multifilament wire and which have enlarged bird cages (300) formed along the jumpers. The jumpers are drawn through a stack of circuit boards to position the cages in contact with plated interconnection apertures (303) located in the printed circuit boards. The frictional engagement of the cages (300) in the apertures (303) provides both electrical interconnection of, and mechanical coupling between the printed circuit boards (212, 214, 219, 221).

Abstract translation: 一种用于通过使用由多丝线形成并具有沿着跳线形成的扩大的鸟笼（300）的双绞线跳线（231）来互连电子电路板（212,214,219,221）的方法和装置。 跳线穿过电路板堆叠以将网格定位成与位于印刷电路板中的电镀互连孔（303）接触。 保持架（300）在孔（303）中的摩擦接合提供印刷电路板（212,214,219,221）之间的电互连和机械耦合。

公开(公告)号：WO2016058741A1

公开(公告)日：2016-04-21

申请号：PCT/EP2015/069613

申请日：2015-08-27

Applicant: ROBERT BOSCH GMBH

Inventor： PEUSER, Thomas

IPC: H05K3/34 ,  H05K1/02 ,  H01G2/08 ,  H01G4/228 ,  H01L23/495

CPC classification number: H01G4/228 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/258 ,  H01G4/30 ,  H01L23/3735 ,  H01L23/49555 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/06 ,  H01L29/861 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0516 ,  H01L2224/06181 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10757 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein elektronisches Bauelement. Das elektronische Bauelement 2 weist ein elektrisches Bauteil 3 mit zwei elektrischen Anschlüssen 4, 5 auf, welche jeweils an zueinander gegenüberliegenden Flächen des Bauteils ausgebildet sind. Das Bauelement weist für jeden Anschluss 4, 5 wenigstens ein elektrisch leitfähiges Anschlusselement 9, 10 mit einem Befestigungsfuß 14, 15 zum Verbinden mit einem Schaltungsträger 22 auf. Erfindungsgemäß weist das Anschlusselement 8, 9 wenigstens auf einem Abschnitt wenigstens zwei Metallschichten 10, 11, 12, 13 auf, wobei die Metallschichten jeweils aus zueinander verschiedenen Metallen gebildet und miteinander stoffschlüssig verbunden sind. Bevorzugt weist eine Metallschicht 12, 13 der Metallschichten eine größere thermische Leitfähigkeit auf als die andere Metallschicht 10, 11.

Abstract translation: 本发明涉及一种电子装置。 电子部件2具有电动部件3与分别形成于所述部件的彼此相对的面上的两个电端子4,5，。 该装置包括，对每个终端4，图5，至少一个导电连接元件9，10的固定脚14，15，用于连接到电路基板22。 根据本发明的至少两个金属层10，11，12，13的至少一个部分，其中所述金属层分别由相互不同的金属形成，且彼此键合的连接元件8,9。 优选地，金属层12，金属层13具有比其他金属层更大的热导率10 11