公开(公告)号：WO2017197340A1

公开(公告)日：2017-11-16

申请号：PCT/US2017/032522

申请日：2017-05-12

Applicant: ROHINNI, LLC

Inventor： PETERSON, Cody ,  WENDT, Justin ,  HUSKA, Andy ,  ADAMS, Clint

IPC: F21V13/00

Abstract: An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.

Abstract translation: 一种装置包括其中具有空隙的覆盖层。 背衬层靠着覆盖层的第一侧布置。 传输层靠着与第一侧相对的覆盖层的第二侧设置，使得腔室形成在传输层和背衬层之间的空隙内。 透射层包括具有第一水平透光率的第一区域和具有大于第一水平透光率的第二水平透光率的第二区域。 传输层被定向为使得第一区域和第二区域中的每一个的至少一部分与空隙重叠。 光源位于传输层的第一区域和背层之间的腔室中。

公开(公告)号：WO2018157085A1

公开(公告)日：2018-08-30

申请号：PCT/US2018/019773

申请日：2018-02-26

Applicant: ROHINNI, LLC

Inventor： HUSKA, Andrew ,  PETERSON, Cody ,  ADAMS, Clinton ,  KUPCOW, Sean ,  WENDT, Justin

IPC: H01L21/68

Abstract: An apparatus includes a circuit substrate including a circuit trace and a micro-sized semiconductor device die electrically connected to the circuit substrate. The micro-sized semiconductor device die has a height not greater than 400 microns and a width not greater than 800 microns. An anisotropic conductive adhesive ("ACA") is disposed between the circuit substrate and the micro-sized semiconductor device die, thereby providing an electrical connection from the circuit substrate to the micro-sized semiconductor device die.

公开(公告)号：WO2018098272A1

公开(公告)日：2018-05-31

申请号：PCT/US2017/063007

申请日：2017-11-22

Applicant: ROHINNI, LLC

Inventor： PETERSON, Cody ,  HUSKA, Andy ,  WENDT, Justin

IPC: H01L21/67

Abstract: An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The semiconductor die is disposed on the transfer surface of the product substrate such that at least a portion of the first surface is in contact with the transfer surface, and at least a portion of the second surface is embedded onto the product substrate, beneath a plane that extends across the transfer surface.

公开(公告)号：WO2020069153A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/053190

申请日：2019-09-26

Applicant: ROHINNI, LLC

Inventor： WENDT, Justin ,  PETERSON, Cody ,  HUSKA, Andrew

IPC: H01L21/68

Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.

公开(公告)号：WO2018209309A1

公开(公告)日：2018-11-15

申请号：PCT/US2018/032438

申请日：2018-05-11

Applicant: ROHINNI, LLC

Inventor： WENDT, Justin ,  HUSKA, Andy ,  KUPCOW, Sean ,  BUSCH, Nicholas, Steven ,  PETERSON, Cody

IPC: H01L21/56 ,  H01L23/28 ,  H01L27/15

CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L2933/005 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/166

Abstract: A waterproof sealed circuit apparatus includes a circuit substrate having a first side opposite a second side. The first side includes a circuit trace. A semiconductor device die is electrically coupled to the circuit trace on the first side of the circuit substrate. A polymer sealing layer is adhered to the first side of the circuit substrate and covers the semiconductor device die. Polymer chains of the sealing layer are crosslinked.

公开(公告)号：WO2018140807A1

公开(公告)日：2018-08-02

申请号：PCT/US2018/015572

申请日：2018-01-26

Applicant: ROHINNI, LLC

Inventor： WENDT, Justin ,  HUSKA, Andrew

IPC: H01L33/00 ,  G09G3/32

Abstract: A semiconductor device array includes a plurality of first semiconductor devices arranged in an array and a plurality of second semiconductor devices distributed throughout the array of the plurality of first semiconductor devices. Each of the second semiconductor devices is interconnected with at least one of the first semiconductor devices. The second semiconductor devices are configured to function as a controller over a function of the at least one of the first semiconductor devices, respectively.

公开(公告)号：WO2020068987A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/052964

申请日：2019-09-25

Applicant: ROHINNI, LLC

Inventor： HUSKA, Andrew ,  PETERSON, Cody ,  WENDT, Justin ,  DUPIN, Luke

IPC: H01L21/68

Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

公开(公告)号：WO2018098246A1

公开(公告)日：2018-05-31

申请号：PCT/US2017/062968

申请日：2017-11-22

Applicant: ROHINNI, LLC

Inventor： WENDT, Justin ,  PETERSON, Cody ,  HUSKA, Andrew

IPC: H01L21/687 ,  H01L21/428

Abstract: An apparatus includes a needle including a hole extending from a first end to a second end through the needle and an energy-emitting device arranged in the hole of the needle. The energy- emitting device being configured to emit a specific wavelength and intensity of energy directed at an electrically -actuatable element to bond a circuit trace and the electrically-actuatable element.

公开(公告)号：WO2018085299A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/059402

申请日：2017-10-31

Applicant: ROHINNI, LLC

Inventor： WENDT, Justin ,  HUSKA, Andrew ,  PETERSON, Cody ,  ADAMS, Clinton ,  KUPCOW, Sean

IPC: H01L21/50 ,  H01L21/67 ,  H01L21/68

Abstract: An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.

Abstract translation: 一种装置包括针和针致动器，以将针移动到针将电可致动元件按压到与电路迹线接触的位置。 当针将电可致动元件按压到与电路迹线接触时，与针和针致动器一起布置的阻尼器减弱了施加到电可致动元件的力。

公开(公告)号：WO2017210221A1

公开(公告)日：2017-12-07

申请号：PCT/US2017/035062

申请日：2017-05-30

Applicant: ROHINNI, LLC

Inventor： PETERSON, Cody ,  HUSKA, Andy ,  WENDT, Justin

IPC: G09F9/33

Abstract: An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.

Abstract translation: 电子设备包括外壳和沉积在设置在外壳中的基板上的LED阵列。 LED阵列被设置成形成标识，通过该标识可以显示标识。