摘要:
A copolycarbonate optical article comprises a polycarbonate composition including: a copolycarbonate having: 2 to 60 mol% of phthalimidine carbonate units, 2 to 90 mol% of high heat carbonate units, and optionally 2 to 60 mol% of bisphenol A carbonate units. The copolycarbonate has less than 100 ppm of each of phthalimidine, high heat bisphenol, and bisphenol A monomers, and less than 5 ppm of various ions, and is prepared from monomers each having a purity of at least 99.6%. The polycarbonate composition has a glass transition temperature of 200 ºC to and a yellowness index of less than 30.
摘要:
Provided are copolycarbonate compositions including a stabilizer package which comprise a phosphorus-containing acid, an ester of phosphorus-containing acid, and an organosulfonic stabilizer where the phosphorus-containing acid and the ester of a phosphorus-containing acid are present in a molar ratio of 1 to 2. The total stabilization package is for example, in the amount by weight of 4 to 32 ppm, 8 to 24 ppm, or 8 to 16 ppm and the organosulfonic stabilizer is, e.g., of 2 to 30 ppm, or 4 to 24 ppm, or 8 to 16 ppm.
摘要:
Compositions and articles include: (a) at least one poly(aliphatic ester)-poly carbonate copolymer; (b) at least one polymer having ester linkages; and (c) a flat glass fiber. Methods of forming an article include: blending at least one poly(aliphatic ester)-poly carbonate copolymer, at least one polymer having ester linkages, and flat glass fiber to form a polymer mixture; and molding the polymer mixture to form the article.
摘要:
A reflective article includes a reflector and a light source. The reflector includes a polymer layer having a first side configured to house a light source, and an opposite second side, and a metal layer disposed on the opposite second side of the polymer layer. The light source is located adjacent to the first side of the polymer layer. A method of making the reflective article is provided, including providing the above-described reflector, and locating a light source adjacent to the first side of the polymer layer. A method of making the reflector is also provided, including providing the polymer layer having a first side configured to house a light source, and an opposite second side, and metallizing at least a portion of the second side. The reflective article is useful for mobile electronic devices.
摘要:
The present disclosure relates to a thermoplastic composition having a better mold release performance. The disclosed thermoplastic composition comprises polycarbonate components, an impact modifier and a mold release composition. Also disclosed is a method for making the disclosed thermoplastic composition and an article of manufacture comprising the disclosed polymer composition.
摘要:
A polymer composition includes a poly(biphenyl etherimide) of the formula wherein Z and R are as defined herein, and having a glass transition temperature of greater than 230C and a second polymer that is not the same as the poly(biphenyl etherimide). A method of making the polymer composition includes melt-mixing the poly(biphenyl etherimide) and the second polymer. Articles comprising the polymer composition and methods of forming the articles are also described.
摘要:
A cover assembly for an electronic device includes a glass layer having a first surface and a second surface opposite the first surface, a first having a first surface and a second surface opposite the first surface, and an optically clear polymer film disposed on the optically clear adhesive on a side opposite the glass layer, the polymer film comprising a thermoplastic polymer. The cover assembly transmits greater than 85% of visible light as determined according to ASTM D1003-00. A method of manufacturing the cover assembly is also described. The cover assembly can be useful for use with an electronic device.
摘要:
A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320C, preferably 245 to 312C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260C, preferably 260 to 350C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.
摘要:
A polycarbonate composition includes: a continuous polycarbonate phase; discontinuous first domains distributed in the continuous phase, and comprising a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and a (meth)acrylate copolymer shell, wherein the first domains have an aspect ratio of at least 1.7, preferably at least 1.8; and discontinuous second domains distributed in the continuous phase, and comprising an alkenyl aromatic-olefin block copolymer impact modifier, wherein the second domains have an aspect ratio of at least 3, preferably at least 4, and a domain size of 6400 square nanometers or less, more preferably 5700 square nanometers or less. Optionally, the polycarbonate composition includes: a polycarbonate; a brominated polycarbonate different from the polycarbonate; a poly(carbonate-siloxane) comprising 30 to 70 weight percent of siloxane blocks; a core-shell silicone-(meth)acrylate impact modifier comprising a silicone elastomer core and an (meth)acrylate copolymer shell; and an alkenyl aromatic-olefin block copolymer impact modifier.
摘要:
A laminate includes a polymer film, a substrate, and an adhesive layer disposed between the polymer film and the substrate. The polymer film includes a first layer including a thermoplastic polymer and a laser-direct structuring additive. A molded article includes a mold insert including the laminate, and a thermoplastic attachment coupled to at least a portion of a second side of the substrate of the laminate. The attachment extends along an edge of the mold insert, and includes a thermoplastic polymer. The molded articles described herein can be particularly useful for components or housings for electrical and electronic devices.