公开(公告)号：WO2005122660A1

公开(公告)日：2005-12-22

申请号：PCT/JP2005/011104

申请日：2005-06-10

Applicant: SHOWA DENKO K.K. ,  NISHIZAWA, Kazuyoshi

Inventor： NISHIZAWA, Kazuyoshi

IPC: H05K3/44

CPC classification number: H05K3/44 ,  H05K1/053 ,  H05K1/056 ,  H05K2203/0315 ,  H05K2203/1105

Abstract: A method of manufacturing an aluminum substrate for printed circuits, comprises an oxide layer forming step and a heat-drying step. At the oxide layer forming step, an anodic oxide layer is formed on at least one surface of an aluminum plate by anodizing the aluminum plate in an electrolytic solution of phosphoric acid concentration: 3 to 20 mass% and bath temperature: not less than 25 ° C but less than 40 ° C. At the heat-drying step, the anodic oxide layer is dried by heating it at 150 to 300 ° C for 0.5 hour or more. According to this method, a proper oxide layer can be formed, resulting in an aluminum substrate for printed circuits capable of enhancing adhesiveness to a resin plate.

Abstract translation: 制造印刷电路用铝基板的方法包括氧化物层形成步骤和加热干燥步骤。 在氧化物层形成工序中，通过在磷酸浓度为3〜20质量％的电解液中阳极氧化铝板，在铝板的至少一个面上形成阳极氧化层，浴温：25℃以上， °C但小于40℃。 在加热干燥步骤中，通过在150〜300℃下加热0.5小时以上来干燥阳极氧化层。 根据该方法，可以形成适当的氧化物层，得到能够提高与树脂板的粘合性的印刷电路用铝基板。