公开(公告)号：WO1997024770A1

公开(公告)日：1997-07-10

申请号：PCT/US1996019790

申请日：1996-12-17

Applicant: SIEMENS COMPONENTS, INC.

Inventor： SIEMENS COMPONENTS, INC. ,  LUMBARD, Marvin

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The heat tolerance of an LED alphanumeric display device (10) having a clear epoxy encapsulation (70) can be improved by matching the coefficient of thermal expansion (CTE) of the inner circuit board (120) to the high CTE of the epoxy. When heat is applied to fix the device to a circuit board, the components will expand at a nearly equal rate, avoiding cracking and failure.

Abstract translation: 可以通过将内部电路板（120）的热膨胀系数（CTE）与环氧树脂的高CTE匹配来改善具有透明环氧树脂封装（70）的LED字母数字显示装置（10）的耐热性。 当施加热量以将装置固定到电路板时，组件将以几乎相等的速率膨胀，避免开裂和故障。

公开(公告)号：WO1997017627A1

公开(公告)日：1997-05-15

申请号：PCT/US1996017974

申请日：1996-11-06

Applicant: SIEMENS COMPONENTS INC.

Inventor： SIEMENS COMPONENTS INC. ,  GERBER, Paul-Martin ,  LUMBARD, Marvin

IPC: G02B06/42

CPC classification number: G02B6/4246 ,  G02B6/426 ,  G02B6/4274

Abstract: An optical send-receive module (10) includes a frame (11) which has a front section, a back side, and a top section. A lens carrier is attached to the front section of the frame. The lens carrier (14) includes one or more lenses (18, 19) which face forward. An integrated circuit carrier (15) is placed within the top section of the frame (11). First metal leads (17) electrically connect components within the lens carrier (15) to an integrated circuit within the integrated circuit carrier (15). Second metal leads (16) extend from the integrated circuit carrier (15), along the top section of the frame, down the back side of the frame (11) and are bent under the frame (11).

Abstract translation: 光发送接收模块（10）包括具有前部，后侧和顶部的框架（11）。 透镜托架附接到框架的前部。 透镜载体（14）包括面向前的一个或多个透镜（18,19）。 集成电路载体（15）放置在框架（11）的顶部部分内。 第一金属引线（17）将透镜载体（15）内的部件电连接到集成电路载体（15）内的集成电路。 第二金属引线（16）沿着框架的顶部部分从集成电路载体（15）沿着框架（11）的后侧向下延伸并且在框架（11）下方弯曲。

公开(公告)号：WO1997024709A3

公开(公告)日：1997-07-10

申请号：PCT/US1996019792

申请日：1996-12-17

Applicant: SIEMENS COMPONENTS, INC.

Inventor： SIEMENS COMPONENTS, INC. ,  LUMBARD, Marvin

IPC: H05K13/00

公开(公告)号：WO1997024213A1

公开(公告)日：1997-07-10

申请号：PCT/US1996019791

申请日：1996-12-17

Applicant: SIEMENS COMPONENTS, INC.

Inventor： SIEMENS COMPONENTS, INC. ,  LUMBARD, Marvin

IPC: B29C45/14

CPC classification number: B29C45/14655

Abstract: A closed mold for encapsulating LED alphanumeric display devices uses opposing plattens and top and bottom plates to achieve a seal about the display device. By providing the display device with a dambar, splatter on the leads is avoided.

Abstract translation: 用于封装LED字母数字显示装置的封闭模具使用相对的平板和顶板和底板来实现关于显示装置的密封。 通过为显示装置提供阻挡条，避免了引线上的飞溅。