Abstract:
A matrix driven electrophoretic display with a multi-layer back plane is disclosed. The display comprises a top electrode layer (302), a display cell layer (304), and a multi-layer back plane (306). In one embodiment, the multi-layer back plane comprises an electrode (204, 214) formed on the top surface of the top substrate(312) of the multi-layer back plane, a conductive via structure (224, 236) through the substrate, and conductive trace (320, 322) connected electrically to the via structure (224, 236) at the bottom surface of the first substrate (312), whereby an electrical connection may be made from the electrode to a structure or component not located immediately beneath the electrode in the multi-layer back plane. In other embodiments, the multi-layer back plane may comprise additional layers (324) and via holes (226, 212), as needed to connect the electrode with the appropriate switching elements and/or driver elements (202, 212), as applicable. Switching elements and/or driver elements, as applicable, may be formed or attached in a different location in the viewing plane of the display than the electrode with which they are associated, and one or more via holes used, as required, to complete required circuit routing without compromising display performance.
Abstract:
The invention is directed to novel methods and compositions useful for improving the performance of electrophoretic displays. The methods comprise adding a high absorbance dye or pigment, or conductive particles or a charge transport material into an electrode protecting layer of the display
Abstract:
A process for forming a patterned conductive structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired conductive structures will be formed in the areas where the printed material is not present, i.e. a negative image of conductive structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired conductive structures will be formed in the areas where the printed material is present, i.e. a positive image of the conductive structure is printed. The conductive material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned electrode structures.
Abstract:
A process for forming a patterned conductive structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired conductive structures will be formed in the areas where the printed material is not present, i.e. a negative image of conductive structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired conductive structures will be formed in the areas where the printed material is present, i.e. a positive image of the conductive structure is printed. The conductive material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned electrode structures.