Abstract:
Provided is a method of manufacturing a nanowire, including: forming a plurality of grid patterns on a grid base layer; forming a sacrificial layer on the grid base layer on which the grid patterns are formed; producing a nanowire grid structure by forming a nanowire base layer on the sacrificial layer; forming a nanowire by wet etching the nanowire base layer; and separating the grid patterns from the nanowire by etching the sacrificial layer. Thus, the method can be provided with the following advantages; Because a wet etching time is adjusted, a width and a height of the nanowire to be produced can be adjusted; the nanowire can be produced at room temperature with a low cost; the nanowire can be produced in large quantities; and in spite of the mass production, the nanowire having high uniformity can be produced.
Abstract:
A method of forming a RFID device includes placing a patterned release layer (34) on an RFID device substrate (12) for use as a stencil. The release layer covers the portions (36) of the RFID device substrate upon which conductive material is not to be placed, in the formation of a patterned layer, such as for formation of an antenna. The release layer may be formed by selectively printing a suitable liquid on portions of the RFID device substrate. Following placement of the release layer, a layer of metal is deposited on the release layer and the open portions of the RFID device substrate. The release layer and the metal overlying the release layer are then removed, leaving the desired pattern of metal of the RFID device substrate (a negative image of the pattern of the release layer).
Abstract:
La présente invention concerne une cellule d'affichage électro-optique (1; 18), en particulier à cristaux liquides, ou cellule photovoltaïque électrochimique comprenant - au moins un substrat avant (2; 20) transparent dont la surface supérieure constitue la face avant (14) de la cellule (1; 18); - au moins un substrat arrière (8; 22) également transparent ou non dont la surface inférieure (12; 31) constitue la face arrière de ladite cellule (1; 18); - un cadre de scellement (36) réunissant les substrats avant (20) et arrière (22) et délimitant un volume (38) pour le confinement étanche d'un milieu électro- optiquement ou photoélectriquement actif; - lesdits substrats avant (20) et arrière (22) comportant sur leurs faces en regard au moins une électrode (24, 26) chacun, ces électrodes (24, 26) étant destinées à être reliées par des pistes conductrices (16; 30, 34) à un circuit électrique d'alimentation ou de commande (10; 56) et venant définir des zones de contact électrique latérales (28, 32), cette cellule étant caractérisée en ce que les pistes conductrices (30, 34) se composent chacune dune première partie (30a, 34a) en contact avec les électrodes à hauteur des zones de contact électrique latérales (28, 32), et dune seconde partie (30b, 34b) s'étendant sur la surface arrière (31) de la cellule (18), des moyens de contact (42) ménagés de façon continue ou discontinue sur la tranche (27) et/ou sur le dos (12; 31) de ladite cellule (1; 18) assurant la jonction électrique entre les premières (30a, 34a) et les deuxièmes parties (30b, 34b) des pistes conductrices (30, 34).
Abstract:
A process for forming a patterned conductive structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired conductive structures will be formed in the areas where the printed material is not present, i.e. a negative image of conductive structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired conductive structures will be formed in the areas where the printed material is present, i.e. a positive image of the conductive structure is printed. The conductive material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned electrode structures.
Abstract:
Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.
Abstract:
The present invention relates to a method for producing a stretchable conductor and/or electrical connection comprising - providing a stretchable substrate, a liquid metal, a conductive metal and an adhesion material in a same evaporator chamber; - depositing the liquid metal; - depositing the adhesion material; - depositing the conductive metal; wherein - the liquid metal, the conductive metal and the adhesion material are deposited by evaporation; and - the deposition by evaporation is made in vacuum.
Abstract:
The invention relates to coating roll substrates in vacuum, particularly to the deposition processes, which are associated with depositing significant amounts of metals or other materials, causing significant thermal loads on the substrate. Nonmetallic roll materials, polymeric films or thin metal foils can be used as substrate. According to the invention the roll vacuum coating device is equipped with a means (7, 8, 9) of hold-down the substrate lateral edges to the supporting surface of the drum (3) and its transverse spreading during the deposition process. The said means of hold-down the substrate lateral edges to the supporting surface of the drum and its transverse spreading can be made as laces of elastic material (7) of special asymmetrical profile, rewound together with the substrate. In other embodiments the means of hold-down the substrate lateral edges to the supporting surface of the drum and its transverse spreading can be made as elastic laces rewound together with the substrate at angle to the drum rotation plane, as an assemblage of pressure rollers mounted at angle to the drum plane, or as disks of equal diameter with the drum, mounted on the drum end faces on trunnion balls, coaxial with the drum. Operating efficiency of the offered method and devices is proved by the experiments, when comparatively thick metal coatings were successfully deposited onto thin polymeric films.
Abstract:
Methods for producing coatings on a glass substrate using combined chemical vapor deposition or other heat concentrated deposition (CHD) techniques. The term "glass" in this context is defined as those materials that crack, break or are otherwise damaged prior to plastic deformation of the material. In combustion chemical vapor deposition CCVD, a reagent and a carrier solution are mixed together to form a reagent mixture. The reagent mixture is then ignited to create a flame (14, 16), or alternatively, the reagent mixture may be fed to a plasma torch or other heat source. The combustion source may vaporize at least part of the reagent, the vapor phase of the reagent contacting the surface of the substrate (A) to be coated. In this manner, a film or coating is formed on the glass substrate (A). In some of the disclosed methods, the glass substrate (A) may be preheated, to avoid differential heating of the glass by the combustion source. Various methods of reducing the differential heating are disclosed. This differential heating may cause thermal shock or breakage of the glass substrate (A).