公开(公告)号：WO2017066702A1

公开(公告)日：2017-04-20

申请号：PCT/US2016/057215

申请日：2016-10-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： GARING, Aldrin Quinones ,  CAMARGO, Miguel

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L24/98 ,  H01L21/02068 ,  H01L21/4835 ,  H01L23/4952 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/799 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85011 ,  H01L2224/85013 ,  H01L2224/85019 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Methods, systems and devices are disclosed for performing a semiconductor processing operation. In some embodiments this includes configuring a wire bonding machine to perform customized movements with a capillary tool of the wire bonding machine, etching bulk contaminants over one or more locations of a semiconductor device with the capillary tool, and applying plasma to the semiconductor device to remove residual contaminants.

Abstract translation: 公开了用于执行半导体处理操作的方法，系统和设备。 在一些实施例中，这包括配置引线接合机器以利用引线接合机器的毛细管工具执行定制移动，利用毛细管工具在半导体器件的一个或多个位置上蚀刻散装污染物，并且将等离子体施加到半导体器件以去除 残留的污染物。