Abstract:
A small format optoelectronic package or device (10) includes a non-electrically conductive substrate (40) partially covered by an electrically conductive can (30). The electrically conductive can (30) has a transparent element (20) affixed to an aperture (32) of the electrically conductive can (30). The electrically conductive can (30) encloses and hermetically seals an optical diode (80), and conductors between the electrically conductive can (30) and the non-electrically conductive substrate (40). The non-electrically conductive substrate (40) has two through-holes formed through a thickness of the non-electrically conductive substrate (40). The two through-holes (44, 46) are filled with an electrically conductive material so as to form two electrically conductive vias (44a, 46a). Additionally, a surface of the non-electrically conductive substrate (40) is organized in two regions. The first region (43) has the electrically conductive plating material applied thereto. The first (44) and second (46) through-holes protrudes through the second region (42). The optical diode (80) has a first lead (74) electrically connected to the first via, (44a) and the optical diode (80) has a second lead (72) electrically connected to the second via (46a).
Abstract:
A device or array of arrayed optical subassemblies includes modular units (70, 80) called one channel sub-assemblies. Each of the one channel sub-assemblies includes a small format optical subassembly attached to a substrate (40) and an optical coupling element all of which is connected to a base (50). The optical coupling element includes a focusing element (20) and a ferrule receiving bore (32). The arrayed device makes it possible to remove and replace one of the one channel sub-assemblies with another one channel sub-assembly. The small format optical subassembly of the one channel sub-assembly may be a transmitter to a receiver. Thus, the device is a modular, high-density, multiple optical transmitter/receiver array.
Abstract:
The transceiver (10) includes a housing (20), a transmitting optical sub-assembly (114) mounted in the housing (20), a receiving optical sub-assembly (116) mounted in the housing (20), a first electrical connector (61) associated with the transmitting optical sub-assembly (114), a second electrical connector (63) associated with the receiving optical sub-assembly (116), and an electro-magnetic shield (30) mounted on the housing (20). The housing (20) includes a first fiber optic connector receptacle (43), a second fiber optic connector receptacle (44), and a first side, and the housing (20) is made of an electrically conductive material.