Abstract:
Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.
Abstract:
Methods for protecting a texturized region and a lightly doped diffusion region of a solar cell to improve solar cell lifetime and efficiency are disclosed. In an embodiment, an example method includes providing a solar cell having a front side which faces the sun during normal operation and a back side opposite the front side, a silicon substrate and where the silicon substrate includes a texturized region and a lightly doped diffusion region. The method includes placing the solar cell on a receiving medium with the front side of the solar cell placed on an upper surface of the receiving medium, where the upper surface of the receiving medium prevents damage to the to the lightly doped diffusion region and damage to the texturized region on the front side of the solar cell during a contact printing process or transferring. In an embodiment, the lightly doped diffusion region has a doping concentration below 1x10 19 cm -3 and the receiving medium includes a material having a moh's hardness in the range of 5-10.
Abstract translation:公开了用于保护太阳能电池的纹理化区域和轻掺杂扩散区域以改善太阳能电池寿命和效率的方法。 在一个实施例中,一种示例性方法包括提供在正常操作期间具有面向太阳的正面和与正面相反的背面的太阳能电池,硅衬底以及硅衬底包括纹理化区域和轻掺杂扩散区域 。 该方法包括将太阳能电池放置在接收介质上,其中太阳能电池的正面放置在接收介质的上表面上,其中接收介质的上表面防止对轻掺杂扩散区的损伤,并损坏 在接触印刷处理或转印期间在太阳能电池的正面上的纹理化区域。 在一个实施例中,轻掺杂扩散区具有低于1×10 19 cm -3的掺杂浓度,并且接收介质包括莫氏硬度在5-10的范围内的材料。
Abstract:
Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
Abstract:
Solar cell contact structures formed from metal paste and methods of forming solar cell contact structures from metal paste are described. In a first example, a solar cell includes a substrate. A semiconductor region is disposed in or above the substrate. A contact structure is disposed on the semiconductor region and includes a conductive layer in contact with the semiconductor region. The conductive layer includes a matrix binder having aluminum/silicon (Al/Si) particles and an inert filler material dispersed therein. In a second example, a solar cell includes a substrate. A semiconductor region is disposed in or above the substrate. A contact structure is disposed on the semiconductor region and includes a conductive layer in contact with the semiconductor region. The conductive layer includes an agent for increasing a hydrophobic characteristic of the conductive layer.
Abstract:
Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.
Abstract:
Approaches for forming barrier-less seed stacks and contacts are described. In an example, a solar cell includes a substrate and a conductive contact disposed on the substrate. The conductive contact includes a copper layer directly contacting the substrate. In another example, a solar cell includes a substrate and a seed layer disposed directly on the substrate. The seed layer consists essentially of one or more non-diffusion-barrier metal layers. A conductive contact includes a copper layer disposed directly on the seed layer. An exemplary method of fabricating a solar cell involves providing a substrate, and forming a seed layer over the substrate. The seed layer includes one or more non-diffusion-barrier metal layers. The method further involves forming a conductive contact for the solar cell from the seed layer.