PACKAGES FOR HIGH-POWER LASER DEVICES
    3.
    发明申请

    公开(公告)号:WO2021076836A1

    公开(公告)日:2021-04-22

    申请号:PCT/US2020/055890

    申请日:2020-10-16

    申请人: TERADIODE, INC.

    IPC分类号: H01S5/024

    摘要: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

    PACKAGES FOR HIGH-POWER LASER DEVICES
    9.
    发明申请
    PACKAGES FOR HIGH-POWER LASER DEVICES 审中-公开
    高功率激光器件包装

    公开(公告)号:WO2017223050A1

    公开(公告)日:2017-12-28

    申请号:PCT/US2017/038271

    申请日:2017-06-20

    申请人: TERADIODE, INC.

    IPC分类号: H01S5/024 B23K26/70

    摘要: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

    摘要翻译: 在各种实施例中,诸如二极管棒的激光发射器在操作期间经由冷却流体的射流冷却,所述冷却流体由激光发射器所位于的冷却器中的端口形成。 射流撞击与激光发射器热耦合的冷却器的冲击表面,但防止冷却流体与激光发射器本身直接接触。