LIGHT EMITTING DIODE (LED) TEST APPARATUS AND METHOD OF MANUFACTURE

    公开(公告)号:WO2018236767A2

    公开(公告)日:2018-12-27

    申请号:PCT/US2018/038112

    申请日:2018-06-18

    Abstract: Embodiments relate to functional test methods useful for fabricating products containing Light Emitting Diode (LED) structures. In particular, LED arrays are functionally tested by injecting current via a displacement current coupling device using a field plate comprising of an electrode and insulator placed in close proximity to the LED array. A controlled voltage waveform is then applied to the field plate electrode to excite the LED devices in parallel for high-throughput. A camera records the individual light emission resulting from the electrical excitation to yield a function test of a plurality of LED devices. Changing the voltage conditions can excite the LEDs at differing current density levels to functionally measure external quantum efficiency and other important device functional parameters. Spectral filtering is used to improve measurement contrast and LED defect detection. External light irradiation is used to excite the LED array and improve onset of charge injection light emission and throughput.

    LIGHT EMITTING DIODE (LED) MASS-TRANSFER APPARATUS AND METHOD OF MANUFACTURE

    公开(公告)号:WO2019005818A1

    公开(公告)日:2019-01-03

    申请号:PCT/US2018/039533

    申请日:2018-06-26

    Abstract: Embodiments relate to mass-transfer methods useful for fabricating products containing Light Emitting Diode (LED) structures. LED arrays are transferred from a source substrate to a target substrate by beam-assisted release (BAR) of a plurality of LED devices in a high-speed flexible manner. The BAR mass-transfer approach is also able to utilize a Known Good Die (KGD) data file of the source substrate to transfer only functionally good die and avoid rework and yield losses.

    LIGHT EMITTING DIODE (LED) TEST APPARATUS AND METHOD OF MANUFACTURE

    公开(公告)号:WO2018136970A1

    公开(公告)日:2018-07-26

    申请号:PCT/US2018/014917

    申请日:2018-01-23

    Abstract: Embodiments relate to functional test methods useful for fabricating products containing Light Emitting Diode (LED) structures. In particular, LED arrays are functionally tested by injecting current via a displacement current coupling device using a field plate comprising of an electrode and insulator placed in close proximity to the LED array. A controlled voltage waveform is then applied to the field plate electrode to excite the LED devices in parallel for high-throughput. A camera records the individual light emission resulting from the electrical excitation to yield a function test of a plurality of LED devices. Changing the voltage conditions can excite the LEDs at differing current density levels to functionally measure external quantum efficiency and other important device functional parameters.

    LIGHT EMITTING DIODE (LED) TEST APPARATUS AND METHOD OF MANUFACTURE

    公开(公告)号:WO2018236767A3

    公开(公告)日:2018-12-27

    申请号:PCT/US2018/038112

    申请日:2018-06-18

    Abstract: Embodiments relate to functional test methods useful for fabricating products containing Light Emitting Diode (LED) structures. In particular, LED arrays are functionally tested by injecting current via a displacement current coupling device using a field plate comprising of an electrode and insulator placed in close proximity to the LED array. A controlled voltage waveform is then applied to the field plate electrode to excite the LED devices in parallel for high-throughput. A camera records the individual light emission resulting from the electrical excitation to yield a function test of a plurality of LED devices. Changing the voltage conditions can excite the LEDs at differing current density levels to functionally measure external quantum efficiency and other important device functional parameters. Spectral filtering is used to improve measurement contrast and LED defect detection. External light irradiation is used to excite the LED array and improve onset of charge injection light emission and throughput.

    LIGHT EMITTING DIODE (LED) TEST APPARATUS AND METHOD OF MANUFACTURE

    公开(公告)号:WO2018112267A1

    公开(公告)日:2018-06-21

    申请号:PCT/US2017/066530

    申请日:2017-12-14

    Abstract: Embodiments relate to functional test methods useful for fabricating products containing Light Emitting Diode (LED) structures. In particular, LED arrays are functionally tested by injecting current via a displacement current coupling device using a field plate comprising of an electrode and insulator placed in close proximity to the LED array. A controlled voltage waveform is then applied to the field plate electrode to excite the LED devices in parallel for high-throughput. A camera records the individual light emission resulting from the electrical excitation to yield a function test of a plurality of LED devices. Changing the voltage conditions can excite the LEDs at differing current density levels to functionally measure external quantum efficiency and other important device functional parameters.

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