公开(公告)号：WO2016168649A2

公开(公告)日：2016-10-20

申请号：PCT/US2016/027827

申请日：2016-04-15

申请人： TREADSTONE TECHNOLOGIES, INC.

发明人： WANG, Conghua ,  TAO, Yong ,  ZHANG, Lin ,  GONTARZ, Gerald, A.

IPC分类号： C23C14/32 ,  C23C14/16

CPC分类号： C23C14/325 ,  C21D6/002 ,  C21D9/0068 ,  C22C14/00 ,  C22F1/183 ,  C23C4/02 ,  C23C4/08 ,  C23C4/12 ,  C23C8/10 ,  C23C14/02 ,  C23C14/021 ,  C23C14/16 ,  C23C14/165 ,  C23C14/35 ,  C23C28/321 ,  C23C28/345 ,  C23F1/26 ,  C23F1/28 ,  C23F17/00 ,  C25B15/00 ,  H01G9/055 ,  H01G11/70 ,  H01M4/661 ,  H01M4/662 ,  H01M4/667 ,  H01M8/0206 ,  H01M8/0208 ,  H01M8/021 ,  H01M8/0228 ,  H01M8/1018 ,  H01M2008/1095 ,  Y02E60/13

摘要： Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/ cm 2 and 5 billion cm 2 .

摘要翻译： 用于形成金属部件表面以实现较低的电接触电阻的方法。 该方法包括修改表面化学组合物并产生包括小峰和/或凹坑的金属组分的微观纹理表面结构。 小的峰和坑具有圆形或不规则的横截面形状，直径在10nm和10微米之间，高度/深度在10nm和10微米之间，分布密度在0.4百万/ sup>和50亿cm 2 。

公开(公告)号：WO2011038406A9

公开(公告)日：2011-03-31

申请号：PCT/US2010/050578

申请日：2010-09-28

申请人： TREADSTONE TECHNOLOGIES, INC. ,  WANG, Conghua ,  ZHANG, Lin ,  GONTARZ, Gerald, A, Jr.

发明人： WANG, Conghua ,  ZHANG, Lin ,  GONTARZ, Gerald, A, Jr.

IPC分类号： C23C4/12 ,  C23C4/06 ,  B22F1/02

摘要： A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly or partially surrounded by an electrically conductive ceramic material such as a metal nitride material. The metal cores may have the ceramic material formed on them prior to a thermal spraying process performed in an inert atmosphere, or the thermal spraying may be performed in a reactive atmosphere such that the ceramic coating forms on the cores during the thermal spraying process and/or after deposition. The metal cores will bond conductive ceramic material onto the surface of the substrate through the thermal spray process.

摘要翻译： 公开了一种使用新型结构化金属 - 陶瓷复合粉末来通过将该结构化粉末热喷涂到金属基材的表面上来改善耐腐蚀金属基材的表面电导率的方法。 结构化粉末具有金属芯，并且完全或部分地被诸如金属氮化物材料的导电陶瓷材料包围。 在惰性气氛中执行热喷涂工艺之前，金属芯可以具有在其上形成的陶瓷材料，或者可以在反应性气氛中执行热喷涂，使得在热喷涂工艺期间陶瓷涂层在芯上形成和/ 或沉积之后。 金属芯将通过热喷涂工艺将导电陶瓷材料结合到基板的表面上。