公开(公告)号：WO2014179621A1

公开(公告)日：2014-11-06

申请号：PCT/US2014/036455

申请日：2014-05-01

Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.

Inventor： MATAYA, Richard A. ,  SALESSI, Nader M.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K7/20481 ,  H05K7/20454 ,  Y10T29/49366

Abstract: A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component.

Abstract translation: 公开了用于从部件散热的热界面材料（TIM）垫。 TIM垫包括多个热界面材料层和介于多个TIM层之间的至少一个石墨烯层。 用于形成TIM垫的方法包括：将至少一个石墨烯层插入在多个TIM层之间堆叠多个TIM层以达到TIM垫的长度。 堆叠的层被切割成对应于TIM垫的厚度以抵抗该部件。

公开(公告)号：WO2014169152A1

公开(公告)日：2014-10-16

申请号：PCT/US2014/033699

申请日：2014-04-10

Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.

Inventor： MATAYA, Richard A. ,  CAMPBELL, Tegan

IPC: G11C16/02 ,  G11C7/04

CPC classification number: G06F1/20 ,  B82Y10/00 ,  G06F1/18 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H05K1/0206 ,  H05K1/181 ,  H05K2201/10159 ,  Y10S977/734 ,  Y10S977/932

Abstract: An electronic device including a printed circuit board (PCB) including a thermal conduction plane and at least one heat generating component mounted on the PCB and connected to the thermal conduction plane. A frame is connected to the PCB so as to define a first thermally conductive path between at least a portion of the frame and the at least one heat generating component. The electronic device further includes at least one thermally conductive layer between the frame and the at least one heat generating component so as to define a second thermally conductive path between at least a portion of the frame and the at least one heat generating component.

Abstract translation: 一种电子设备，包括包括导热平面的印刷电路板（PCB）和安装在PCB上并连接到导热平面的至少一个发热元件。 框架连接到PCB，以便限定在框架的至少一部分与至少一个发热部件之间的第一导热路径。 电子设备还包括在框架和至少一个发热部件之间的至少一个导热层，以便在框架的至少一部分与至少一个发热部件之间限定第二导热路径。