CURABLE EPOXY COMPOSITIONS AND METHODS FOR ACCELERATING THE CURING OF EPOXY COMPOSITIONS
    3.
    发明申请
    CURABLE EPOXY COMPOSITIONS AND METHODS FOR ACCELERATING THE CURING OF EPOXY COMPOSITIONS 审中-公开
    可固化环氧组合物和用于促进环氧组合物固化的方法

    公开(公告)号:WO2017106596A1

    公开(公告)日:2017-06-22

    申请号:PCT/US2016/067092

    申请日:2016-12-16

    Abstract: Methods for controlling the cure time of curable epoxy compositions include selecting an aromatic carboxylic acid accelerator that has a log P value in the range of from -0.5 to 4.0, where P is the partition coefficient. The curable epoxy compositions are essentially free of water and include an aromatic epoxy resin, an amine curing agent and the accelerator. When the amine curing agent is an aliphatic or cycloaliphatic amine, the curable composition cures in less than 1 hour at room temperature. When the amine curing agent is an aromatic amine, heat is applied to effect curing.

    Abstract translation: 控制可固化环氧组合物固化时间的方法包括选择具有-0.5至4.0范围内的logP值的芳族羧酸促进剂,其中P是分配系数。 可固化的环氧组合物基本上不含水,并且包括芳族环氧树脂,胺固化剂和促进剂。 当胺固化剂是脂族或脂环族胺时,可固化组合物在室温下在不到1小时内固化。 当胺固化剂是芳香胺时,加热进行固化。

    CURABLE RESIN COMPOSITION, PREPREG COMPRISING IT AND METHOD FOR MAKING A COMPOSITE MATERIAL FROM THE COMPOSITION
    4.
    发明申请
    CURABLE RESIN COMPOSITION, PREPREG COMPRISING IT AND METHOD FOR MAKING A COMPOSITE MATERIAL FROM THE COMPOSITION 审中-公开
    可固化树脂组合物,包含该组合物的预浸料以及由该组合物制备复合材料的方法

    公开(公告)号:WO2017050995A3

    公开(公告)日:2017-04-27

    申请号:PCT/EP2016072742

    申请日:2016-09-23

    Inventor: ASPIN IAN

    Abstract: A curable resin composition containing: (a) at least one resin; and (b) curative selected from the group consisting of (i) a mixture of at least one low temperature curative and at least one high temperature curative or (ii) a curative that has a low temperature curative part and a high temperature curative part wherein the amount of the low temperature curative is sufficient to cause enough resin-curative addition reaction to effect B-staging in the full resin-curative formulation, the amount of the high temperature curative is sufficient to cause the resin to cure catalytically but insufficient to cause resin-curative addition reaction in the final cure, and the ratio of the resin (a) to the curative (b) is greater than or equal to about 5. The present composition may be used to make prepregs for automotive or aerospace application.

    Abstract translation: 一种可固化树脂组合物,含有:(a)至少一种树脂; 和(b)选自(i)至少一种低温固化剂和至少一种高温固化剂的混合物或(ii)具有低温固化剂部分和高温固化剂部分的固化剂的固化剂,其中 低温固化剂的量足以引起足够的树脂硫化加成反应以在全树脂固化制剂中进行B阶段化,高温固化剂的量足以引起树脂催化固化但不足以引起 在最终固化中树脂固化加成反应,以及树脂(a)与固化剂(b)的比率大于或等于约5.本发明组合物可用于制造用于汽车或航空应用的预浸料坯。

    CURING COMPOSITIONS
    5.
    发明申请
    CURING COMPOSITIONS 审中-公开
    固化组合物

    公开(公告)号:WO2016185209A1

    公开(公告)日:2016-11-24

    申请号:PCT/GB2016/051436

    申请日:2016-05-18

    Applicant: AQDOT LIMITED

    Abstract: Provided are epoxy compositions comprising a cucurbituril in complex with a curative, and methods for curing the epoxy composition. The curative is reactive with an epoxy compound, and the curative may be a cure accelerator or a cure hardener. The invention also provides cured resins obtained or obtainable from the epoxy compositions. Also provided are complexes of a cucurbituril with a curative.

    Abstract translation: 提供了包含与治疗剂复合的葫芦素的环氧组合物和用于固化环氧组合物的方法。 固化剂与环氧化合物反应,固化剂可以是固化促进剂或固化硬化剂。 本发明还提供由环氧组合物获得或可获得的固化树脂。 还提供了葫芦素与治疗剂的复合物。

    STRUCTURAL ADHESIVE COMPOSITIONS
    7.
    发明申请
    STRUCTURAL ADHESIVE COMPOSITIONS 审中-公开
    结构粘合剂组合物

    公开(公告)号:WO2013086277A3

    公开(公告)日:2013-08-15

    申请号:PCT/US2012068378

    申请日:2012-12-07

    Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.

    Abstract translation: 本文公开了包含(a)第一组分的组合物,其包含(1)作为包含第一环氧化合物,多元醇和酸酐和/或二酸的反应物的反应产物的环氧加合物和(2)第二环氧树脂 复合; (b)具有核/壳结构和/或石墨烯碳颗粒的橡胶颗粒; 和(c)在环境温度或轻微条件下与第一组分发生化学反应的第二组分。 本文还公开了包含(a)环氧树脂封端的增韧剂的组合物; (b)热活化潜伏性固化剂; 和(c)具有核/壳结构和/或石墨烯碳颗粒的橡胶颗粒; (d)环氧/ CTBN加合物; 和/或(e)环氧/二聚酸加合物。

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