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    METALIZATION OF SURFACES
    1.
    发明申请
    METALIZATION OF SURFACES 审中-公开
    表面的金属化

    公开(公告)号：WO2015165875A3

    公开(公告)日：2015-12-23

    申请号：PCT/EP2015059145

    申请日：2015-04-28

    Applicant: CUPTRONIC TECHNOLOGY LTD

    Inventor： ATTHOFF BJÖRN ,  GÖTHE SVEN

    IPC: C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  H05K3/18 ,  H05K3/38

    CPC classification number: C23C18/1882 ,  B05D1/28 ,  B05D3/061 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/1862 ,  C23C18/2006 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  C25D3/38 ,  C25D5/10 ,  C25D5/54 ,  H05K3/1275 ,  H05K3/182 ,  H05K3/387

    Abstract: There is disclosed a method for application of a metal on a substrate, comprising the steps: a) contacting at least a part of the surface of the substrate with at least one selected from: i) at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, and ii) a polymer comprising at least one charged group. The contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate. Subsequently a metal layer is produced on the surface. Advantages include that the compactness of the applied metal layer increases compared to similar methods according to the prior art.

    Abstract translation: 公开了一种用于在基底上施加金属的方法，包括以下步骤：a）使基底的至少一部分表面与选自以下的至少一种接触：i）至少一种引发剂和可聚合单元，其中 经历化学反应形成聚合物的能力，所述聚合物包含至少一个带电基团，和ii）包含至少一个带电荷基团的聚合物。 通过使垫与包含至少一种物质的板接触并随后使垫与基底表面接触，由此将至少一种物质转移到基底表面来实现接触。 随后在表面上产生金属层。 优点包括与根据现有技术的类似方法相比，所施加的金属层的紧凑性增加。

    METALIZATION OF SURFACES
    2.
    发明申请
    METALIZATION OF SURFACES 审中-公开
    表面金属化

    公开(公告)号：WO2015165875A2

    公开(公告)日：2015-11-05

    申请号：PCT/EP2015/059145

    申请日：2015-04-28

    Applicant: CUPTRONIC TECHNOLOGY LTD.

    Inventor： ATTHOFF, Björn ,  GÖTHE, Sven

    IPC: C23C18/16

    CPC classification number: C23C18/1882 ,  B05D1/28 ,  B05D3/061 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/1862 ,  C23C18/2006 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/40 ,  C25D3/38 ,  C25D5/10 ,  C25D5/54 ,  H05K3/1275 ,  H05K3/182 ,  H05K3/387

    Abstract: There is disclosed a method for application of a metal on a substrate, comprising the steps: a) contacting at least a part of the surface of the substrate with at least one selected from: i) at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, and ii) a polymer comprising at least one charged group. The contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate. Subsequently a metal layer is produced on the surface. Advantages include that the compactness of the applied metal layer increases compared to similar methods according to the prior art.

    Abstract translation: 公开了一种在衬底上施加金属的方法，包括以下步骤：a）使至少一部分衬底的表面与选自以下的至少一种接触：i）至少一种引发剂和可聚合单元与 经历化学反应以形成聚合物的能力，所述聚合物包含至少一个带电基团，和ii）包含至少一个带电基团的聚合物。 接触是通过将焊盘与包含至少一种物质的板接触并随后使焊盘与衬底的表面接触，从而将至少一种物质转移到衬底的表面来实现的。 随后在表面上产生金属层。 优点包括与现有技术的类似方法相比，施加的金属层的紧密度增加。

    ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH SPREADER DUCT
    4.
    发明申请
    ROLL-TO-ROLL ELECTROLESS PLATING SYSTEM WITH SPREADER DUCT 审中-公开
    滚筒式滚筒电镀系统

    公开(公告)号：WO2016040005A1

    公开(公告)日：2016-03-17

    申请号：PCT/US2015/047350

    申请日：2015-08-28

    Applicant: EASTMAN KODAK COMPANY

    Inventor： WAINWRIGHT, Gary, P. ,  REUTER, Shawan, A.

    IPC: C23C18/16 ,  C23C18/38

    CPC classification number: C23C18/1862 ,  C23C18/1619 ,  C23C18/1628 ,  C23C18/1669 ,  C23C18/1675 ,  C23C18/1683 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42

    Abstract: A roll-to-roll electroless plating system including a sump and a pan containing a plating solution. A web advance system advances a web of substrate though the plating solution in the pan along a web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate. A pan-replenishing pump moves plating solution from the sump to an inlet of the pan through a pipe connected to an outlet of the pan-replenishing pump, the inlet of the pan being located below the web of substrate. A spreader duct includes a channel that is in fluidic communication with the inlet of the pan, wherein the channel is positioned below the web of substrate and includes at least one outlet disposed beyond the first edge or the second edge of the web of substrate.

    Abstract translation: 一种卷对卷无电镀系统，其包括贮槽和含有电镀液的盘。 纸幅提前系统沿纸幅前进方向通过盘中的电镀溶液推进基板的网状物，其中电镀溶液中的电镀物质镀在基板的表面上的预定位置上。 平底锅补充泵通过与锅补充泵的出口连接的管道将电镀液从贮槽移动到锅的入口，锅的入口位于基底的下方。 扩张器管道包括与盘的入口流体连通的通道，其中，通道定位在基板的幅材下方，并且包括设置在基板的幅材的第一边缘或第二边缘之外的至少一个出口。

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