Abstract:
Die vorliegende Erfindung betrifft eine optische Anordnung und ein Verfahren zur Laserinterferenzstrukturierung einer Probe (10). Die optische Anordnung weist eine Laserstrahlungsquelle (1) zum Emittieren eines Laserstrahls (11), ein Strahlteilerelement (4), das den Laserstrahl (11) in zwei Teilstrahlen (12, 13) derart aufteilt, dass einer der zwei Teilstrahlen (12, 13) innerhalb des Strahlteilerelements (4) einen längeren Weg durchläuft als der andere Teilstrahl (12, 13), ein Umlenkelement (5), das einen der beiden Teilstrahlen (12, 13) derart umlenkt, dass beide Teilstrahlen (12, 13) im Wesentlichen parallel zueinander verlaufen, und ein Fokussierelement (9) auf, das die beiden im Wesentlichen parallel zueinander verlaufenden Teilstrahlen (12, 13) durchlaufen, so dass die Teilstrahlen (12, 13) auf einer Oberfläche der Probe (10) interferieren.
Abstract:
A system and method may utilize holography to facilitate fabrication techniques such as 3D printing and lithography. The system may include a light source, a hologram of an original object or lithographic pattern recorded in a holographic medium, and a target such as a reservoir of photosensitive material or a photosensitive material attached to a substrate. Illuminating the hologram with the appropriate light source may cause a holographic image of the original object or lithographic pattern to form on the photosensitive material within the reservoir or on the substrate. Formation of the holographic image may result in the formation of a new object from the photosensitive material, or may facilitate removal or retention of photosensitive material as part of a lithographic process.
Abstract:
A method for printing a periodic pattern (19) of features into a photosensitive layer (21), which method includes providing a mask (18) bearing a mask pattern, providing a substrate (20) bearing the layer, arranging the substrate parallel to the mask, providing a number of lasers (1) having a plurality of peak wavelengths, forming from said light a beam for illuminating the mask with a spectral distribution of exposure dose and a degree of collimation, illuminating the mask with said beam such that the light of each wavelength transmitted by the mask pattern forms a range of transversal intensity distributions between Talbot planes and exposes the photosensitive layer to an image component, wherein the separation and spectral distribution are arranged so that the superposition of said components is equivalent to an average of the range of transversal intensity distributions formed by light of one wavelength and the collimation is arranged so that the features are resolved.
Abstract:
A method for printing a periodic pattern having a first symmetry and a first period into a photosensitive layer that includes providing a mask bearing a pattern of at least two overlapping sub-patterns which have a second symmetry and a second period, the features of each sub-pattern being formed in a transmissive material, providing a substrate bearing the layer, arranging the mask with a separation from the substrate, providing light having a central wavelength for illuminating the mask to generate a light-field in which light of the central wavelength forms a range of intensity distributions between Talbot planes, illuminating said mask pattern with said light whilst maintaining the separation or changing it by a distance whereby the photosensitive layer is exposed to an average of the range of intensity distributions, wherein the light transmitted by each sub-pattern is shifted in phase relative to that transmitted by another sub-pattern.
Abstract:
Methods and systems are disclosed that provide multiple lithography exposures on a wafer, for example, using interference lithography and optical photolithography. Various embodiments may balance the dosage and exposure rates between the multiple lithography exposures to provide the needed exposure on the wafer. Other embodiments provide for assist features and/or may apply resolution enhancement to various exposures. In a specific embodiment, a wafer is first exposed using optical photolithography and then exposed using interference lithography.
Abstract:
A lithography scanner and track system is provided that includes an interference lithography system according to one embodiment. The scanner provides a first optical exposure of a wafer. The track system provides pre and post-processing functions on a wafer. The interference lithography system may be included within the scanner and may expose a wafer either before or after the first optical exposure. The interference lithography system may also be included within the track system as part of the pre or post processing. The first optical exposure may include optical photolithography.
Abstract:
Systems and techniques for printing substrates. In one implementation, a method includes patterning a substrate with a substantially arbitrary arrangement of features by introducing irregularity into an array of repeating lines and spaces between the lines.
Abstract:
Systems and techniques for printing substrates. In one implementation, a method includes patterning a substrate with a substantially arbitrary arrangement of features by introducing irregularity into an array of repeating lines and spaces between the lines.
Abstract:
A composite patterning technique may include two lithography processes. A first lithography process may use interference lithography to form an interference pattern of lines of substantially equal width and spaces on a photoresist. A second lithography process may use one or more non-interference lithography techniques, such as optical lithography, imprint lithography and electron-beam lithography, to break continuity of the patterned lines and form desired integrated circuit features.
Abstract:
Systems and techniques for printing substrates. In one implementation, a method includes patterning a substrate with a substantially arbitrary arrangement of features by introducing irregularity into a repeating array of features.