公开(公告)号：WO2022126016A2

公开(公告)日：2022-06-16

申请号：PCT/US2021/063094

申请日：2021-12-13

Applicant: QORVO US, INC.

Inventor： COSTA, Julio C. ,  MAXIM, George ,  SCOTT, Baker

IPC: H01L25/10 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L23/552 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/96 ,  H01L2225/1041 ,  H01L2225/1047 ,  H01L2225/1088 ,  H01L24/10 ,  H01L24/19 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2924/10329

Abstract: The present disclosure relates to a multi-level three-dimensional (3D) package with multiple package levels vertically stacked. Each package level includes a redistribution structure and a die section over the redistribution structure. Each die section includes a thinned die that includes substantially no silicon substrate and has a thickness between several micrometers and several tens of micrometers, a mold compound, and an intermediary mold compound. Herein, the thinned die and the mold compound are deposed over the redistribution structure, the mold compound surrounds the thinned die and extends vertically beyond a top surface of the thinned die to define an opening over the thinned die and within the mold compound, the intermediary mold compound resides over the thinned die and fills the opening within the inner mold compound, such that a top surface of the intermediary mold compound and a top surface of the mold compound are coplanar.