公开(公告)号：WO2021076872A2

公开(公告)日：2021-04-22

申请号：PCT/US2020/055953

申请日：2020-10-16

申请人： QUALCOMM INCORPORATED

发明人： SUN, Yangyang ,  HOLMES, John ,  ZHANG, Xuefeng ,  HE, Dongming

IPC分类号： H01L23/485 ,  H01L21/60 ,  G06T7/00 ,  G06T7/0006 ,  H01L2224/037 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16112 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2924/15747

摘要： Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.