公开(公告)号：WO2021202038A1

公开(公告)日：2021-10-07

申请号：PCT/US2021/020549

申请日：2021-03-02

Applicant: MICRON TECHNOLOGY, INC.

Inventor： JENSEN, Travis, M. ,  HEMBREE, David, R.

IPC: H01L25/065 ,  H01L23/485 ,  H01L23/525 ,  H01L21/60 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06586 ,  H01L24/02 ,  H01L25/0657 ,  H01L25/50 ,  H01L2924/15311

Abstract: Semiconductor devices having redistribution structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor package includes a first semiconductor die including a first redistribution structure and a second semiconductor die including a second redistribution structure. The first and second semiconductor dies can be mounted on a package substrate such that the first and second redistribution structures are aligned with each other. In some embodiments, an interconnect structure can be positioned between the first and second semiconductor dies to electrically couple the first and second redistribution structures to each other. The first and second redistribution structures can be configured such that signal routing between the first and second semiconductor dies can be altered based on the location of the interconnect structure.