中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

944 records (took 0.014 seconds)

    APPARATUS FOR COOLING
    2.
    发明申请
    APPARATUS FOR COOLING 审中-公开

    公开(公告)号：WO2023011969A1

    公开(公告)日：2023-02-09

    申请号：PCT/EP2022/070865

    申请日：2022-07-26

    Applicant: NOKIA TECHNOLOGIES OY

    Inventor： AMALFI, Raffaele Luca ,  GRILLANDA, Stefano ,  ENRIGHT, Ryan ,  BOLLE, Cristian ,  EARNSHAW, Mark

    IPC: H01L23/367 ,  H01L23/38 ,  H01L23/427 ,  H01L23/34

    Abstract: Examples of the disclosure relate to apparatus for cooling components such as electronic circuitry components and photonic components. A first component and a second component are provided on the same surface of a substrate. At least one temperature control means, such as a thermoelectric cooler, is configured to control the temperature of at least one of the components. The apparatus also comprises a plurality of heat transfer means that extend through the substrate from the first surface to the second surface. The plurality of heat transfer means enable heat to be transferred from the components to a heat pipe provided on the second surface of the substrate. This enables heat to be transferred through the substrate and away from the components and so can reduce the amount of heat that spreads laterally across the substrate. This allows for efficient removal of heat from the components and reduces heat transfer between the components.

    芯片封装结构及其制备方法、封装系统
    3.
    发明申请
    芯片封装结构及其制备方法、封装系统 审中-公开

    公开(公告)号：WO2022261947A1

    公开(公告)日：2022-12-22

    申请号：PCT/CN2021/100936

    申请日：2021-06-18

    Applicant: 华为技术有限公司

    Inventor： 康乐 ,  刘晓国 ,  袁灵成 ,  徐斌 ,  贺志强

    IPC: H01L23/34

    Abstract: 本申请提供了一种芯片封装结构及其制备方法、封装系统，其芯片封装结构。包括封装基板、芯片Die和第一封装体；封装基板具有相对的第一表面和第二表面；芯片耦合于封装基板，芯片具有热点；封装基板的第一表面设置有散热连接点，封装基板内形成有连通散热连接点与热点的导热通道；第二表面设置有用于外接器件的第一连接端子；第一封装体设置于第一表面，且第一封装体内形成有导热结构，导热结构自散热连接点延伸至第一封装体的表面。由于散热连接点与芯片的热点位置对应，通过散热连接点和导热结构可以对芯片的热点进行针对性散热；导热结构可以灵活设置，其结构形成能够与芯片封装结构的制作流程紧密结合。

    METHOD AND SYSTEM FOR LASER BEAM SENSING AND PROFILING
    5.
    发明申请
    METHOD AND SYSTEM FOR LASER BEAM SENSING AND PROFILING 审中-公开

    公开(公告)号：WO2022217074A1

    公开(公告)日：2022-10-13

    申请号：PCT/US2022/024053

    申请日：2022-04-08

    Applicant: RAM PHOTONICS, LLC

    Inventor： ADAMSON, Per ,  CINQUINO, Mike ,  LAWSON, Joey ,  LEIDNER, Jordan

    IPC: G01J1/42 ,  G01J5/10 ,  H01L35/32 ,  H01L23/34 ,  H01L27/30 ,  F25D31/00

    Abstract: A system for determining the profile of a laser beam includes a detector having a thermochromic liquid crystal film (TLCF) in thermal communication with a heat spreader and a thermoelectric cooler. The liquid crystal film has a thermochromic response such that heating of the film by a received laser beam creates a detectable color response at the film. The system also includes an image sensor and a controller configured to output an operating current for the TEC and receive images from the sensor. The system can selectively vary the temperature set point of the TEC to change the steady state temperature of the TLCF to examine the full intensity profile of the received beam even when the temperature response bandwidth of the TLCF is too narrow to display the full beam profile in a single color spot.

    SYSTEMS FOR THERMAL MANAGEMENT AND METHODS THEREOF
    6.
    发明申请
    SYSTEMS FOR THERMAL MANAGEMENT AND METHODS THEREOF 审中-公开

    公开(公告)号：WO2022187106A1

    公开(公告)日：2022-09-09

    申请号：PCT/US2022/018041

    申请日：2022-02-25

    Applicant: HOLO, INC.

    Inventor： BODLA, Karthik ,  GAO, Xiangyu ,  AGHABABAIE, Arian ,  POMEROY, Jonathan

    IPC: G06F1/20 ,  H05K7/20 ,  H01L23/34

    Abstract: The present disclosure provides a thermal management device. In some cases, the thermal management device may comprise a first portion of a housing. The first portion may be configured to facilitate a transfer of a first thermal energy from a first surface of an integrated circuit module (ICM) to a surface of the first portion, or vice versa. The thermal management device may further comprise a first plurality of channels disposed within the first portion. The first plurality of channels may be configured to provide a first fluid flow path in thermal contact with the first portion. The first fluid flow path may be configured to facilitate a transfer of the first thermal energy from the first portion to a cooling fluid disposed within the first fluid flow path.

    電子デバイス
    7.
    发明申请
    電子デバイス 审中-公开

    公开(公告)号：WO2022145202A1

    公开(公告)日：2022-07-07

    申请号：PCT/JP2021/045550

    申请日：2021-12-10

    Applicant: 株式会社村田製作所

    Inventor： 岩本　敬

    IPC: H01L23/34 ,  H01L23/373 ,  H03H9/25

    Abstract: 電子デバイス（１００）は、基板（１０）と、ベース基板（２０）と、金属接続体（３０）と、支持体（４０）と、金属体（５０）と、ビア（６０）と、を備える。基板（１０）は、一方の主面に機能素子（１１）が設けられ、圧電基板または化合物半導体基板である。ベース基板（２０）は、一方の主面の側を向けて基板（１０）が実装される。金属体（５０）は、支持体（４０）と接し、支持体（４０）側から平面視した基板（１０）の外側まで少なくとも一部が設けられる。ビア（６０）は、基板（１０）より外側に設けられた金属体（５０）の部分とベース基板（２０）とを接続し、基板（１０）より熱伝導率が高い。

    FLIP-CHIP PACKAGE HAVING IMPROVED THERMAL PERFORMANCE
    8.
    发明申请
    FLIP-CHIP PACKAGE HAVING IMPROVED THERMAL PERFORMANCE 审中-公开

    公开(公告)号：WO2022110085A1

    公开(公告)日：2022-06-02

    申请号：PCT/CN2020/132538

    申请日：2020-11-28

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： KEISHI, Okamoto ,  ZHU, Ningjun ,  SAKAMOTO, Hitoshi ,  YANG, Chengpeng

    IPC: H01L23/34 ,  H01L21/56

    Abstract: A flip-chip package (200) comprises: at least one chip (202) configured to connect with a substrate (201); a molded member (209) formed on the substrate (201) to wrap a side portion of the at least one chip (202) and lay a top surface of each chip (202) bare, wherein an upper surface of the molded member (209) has a first area continuous with the top surface of each chip (202), a second area to which an adhesive (210) is applied and a wall-like structure (209a) placed to surround the top surface of each chip (202), and the first and second areas are separated by the wall-like structure (209a); a heat spreader (206) placed above the top surface of each chip (202) and glued to the molded member (209) by the adhesive (210) filled in the second area; and a thermal interface material (205) filled in a spatial region formed by the first area, the top surface of each chip (202), at least a part of a bottom surface of the heat spreader (206), and a first side of the wall-like structure (209a).

    METHODS AND SYSTEMS FOR FABRICATION OF MMIC AND RF DEVICES ON ENGINEERED SUBSTRATES
    10.
    发明申请
    METHODS AND SYSTEMS FOR FABRICATION OF MMIC AND RF DEVICES ON ENGINEERED SUBSTRATES 审中-公开

    公开(公告)号：WO2022081749A1

    公开(公告)日：2022-04-21

    申请号：PCT/US2021/054835

    申请日：2021-10-13

    Applicant: QROMIS, INC. ,  AKTAS, Ogzur

    Inventor： ODNOBLYUDOV, Vladimir ,  BASCERI, Cem

    IPC: H01L23/34

    Abstract: A monolithic microwave integrated circuit (MMIC) system includes a growth substrate, a device layer coupled to the growth substrate, a plurality of MMIC device elements coupled to the device layer, and a plurality of metallization structures coupled to the plurality of MMIC device elements. The MMIC system also includes a carrier substrate coupled to the plurality of metallization structures and a cooling structure coupled to the carrier substrate.

Patent Agency Ranking