利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102117753A 封装半导体器件的方法 无效 - 撤回

封装半导体器件的方法
摘要：
本发明涉及封装半导体器件的方法。使用具有不同宽度的两个不同锯片执行的两个拆分操作来制造方形扁平无引线封装器件，其中第一拆分操作使用宽于第二拆分操作的锯片。在拆分操作之间，用可焊接金属镀敷引线的暴露部分。通过在由第一拆分形成的第一切口内执行第二拆分操作，引线的暴露金属的至少一半保持被镀敷。因此，可以形成更好的焊点，这使得能够进行更简单的视觉检查。
摘要（英）：

The invention relates to a method for packaging a semiconductor device. A square flat lead-free packaging device is manufactured by using two splitting operations executed by two different saw bits with different widths, wherein one saw bit wider than the other saw bit for the second splitting operation is used for the first splitting operation. Between the two splitting operations, an exposure part of a lead is plated with weldable metal. The second splitting operation is executed in a first cut formed by the first splitting operation so that at least one half of exposed metal of the lead is still plated. Therefore, a better welding point can be formed, which ensures that simpler visual inspection can be carried out.

0/0