A semiconductor module (1, 2, 3, 4) comprises: a semiconductor element (10); a metal plate part (50, 501, 502) that is provided with a first surface (50c) on the semiconductor element side and has a fastening part (52, 521, 522) at an end portion; a molded portion (60) that is formed by molding so as to enclose the semiconductor element and the metal plate part; and a cooling plate part (57, 573), which is formed of a member separate from the metal plate part and provided on a side of the metal plate part, said side being on the reverse side of the semiconductor element side-surface (50c), and which has a fin (57a, 573a) on a surface that is on the reverse side of the metal plate part-side surface. The fastening part (52, 521, 522) of the metal plate part (50, 501, 502) is exposed from the molded portion, and the cooling plate part (57, 573) has a fastening part (58) at a position corresponding to the fastening part of the metal plate part.