利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN105323986A 用于多层配线板的制造方法 有权

用于多层配线板的制造方法
摘要：
本公开涉及多层配线板和用于多层配线板的制造方法。根据本公开的用于多层配线板的制造方法包括：在第一热塑性树脂板(10)的表面上形成槽(11)；通过将光施加到第一热塑性树脂板的表面的、除了围绕槽的区域之外的区域，来形成由熔点低于构成第一热塑性树脂板的树脂的熔点的树脂制成的改性层(12b)；利用具有流动性的导电材料填充第一热塑性树脂板的槽；以及通过热压接合来将第二热塑性树脂板(20)接合到第一热塑性树脂板的上面形成有改性层的表面。
摘要（英）：

The invention relates to a multilayer wiring board and a manufacturing method for the multilayer wiring board. The manufacturing method for a multilayer wiring board includes: forming a groove on a surface of a first thermoplastic resin board; forming a modified layer made of resin having a melting point lower than a melting point of resin constituting the first thermoplastic resin board, by applying light to a region of the surface of the first thermoplastic resin board other than a region around the groove; filling the groove of the first thermoplastic resin board with conductive material having fluidity; and bonding a second thermoplastic resin board to the surface of the first thermoplastic resin board, on which the modified layer is formed, by thermocompression bonding.

公开/授权文献
0/0