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发明公开
CN1588618A 带有悬空可动敏感结构的静电键合工艺 失效 - 权利终止

带有悬空可动敏感结构的静电键合工艺
摘要：
带有悬空可动敏感结构的静电键合工艺，涉及半导体静电键合技术领域。现有技术在可动的结构对应的玻璃上淀积一层绝缘层，减少可动结构与玻璃衬底的“粘附”问题，无法消除静电力对可动结构的破坏作用。带有金属电极的玻璃置于恒温热台面上，有金属电极的一面在上；再将上述清洗好的硅片置于玻璃上；硅片上的悬空可动敏感结构与玻璃上的金属电极上下对准；硅片和玻璃上的金属电极接同一正极，两者电位相等，玻璃的下表面接负极，在超静环境中加热，加电压，将硅片上除悬空可动敏感结构部分以外的其余部分与玻璃键合在一起。本发明屏蔽了静电吸引力对可动结构的作用，解决了静电力对不需要键合的悬空可动微结构部分的破坏这个难题，提高了成品率。
摘要（英）：

By prior technology that a layer of insulating layer is deposited on glass corresponding to movable structure, problem of adhesion of movable structure and glass substrate can be reduced, but damaging affect of electrostatic force to movable structure can not be removed. The processing steps are: glass with metal electrode is put on glass that ace with metal electrode is upward, said cleaned silicon chip is put on the glass and the floating movable sensitive structure on silicon chip and the metal electrode on glass are aligned vertically, silicon chip and the metal electrode are connected to positive pole, down face of the glass is connected to negative pole, the other part except floating movable sensitive structure and the glass are bonded together by heating, increasing voltage in excess franknism environment. By the invention, affect of electrostatic attraction to movable structure is shielded, the problem of damaging of electrostatic force to the floating movable structure needing not to be bonded.

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