发明公开
EP2148393A1 CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
审中-公开
VERBINDUNGSSTRUKTURFÜREIN SCHALTKREISELEMENT SCHALTKREISVERBINDUNGSMATERIAL
- 专利标题: CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
- 专利标题(中): VERBINDUNGSSTRUKTURFÜREIN SCHALTKREISELEMENT SCHALTKREISVERBINDUNGSMATERIAL
-
申请号: EP08752686.9申请日: 2008-05-14
-
公开(公告)号: EP2148393A1公开(公告)日: 2010-01-27
- 发明人: KOJIMA, Kazuyoshi , KOBAYASHI, Kouji , ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi
- 申请人: Hitachi Chemical Company, Ltd.
- 申请人地址: 1-1 Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 JP
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: 1-1 Nishi-Shinjuku 2-chome Shinjuku-ku Tokyo 163-0449 JP
- 代理机构: HOFFMANN EITLE
- 优先权: JP2007129221 20070515
- 国际公布: WO2008140094 20081120
- 主分类号: H01R11/01
- IPC分类号: H01R11/01 ; C09J9/02 ; C09J201/00 ; H01B1/00 ; H01B1/22 ; H01B5/16 ; H01L21/60 ; H05K3/36
摘要:
A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.
信息查询