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1.发明公开CIRCUIT CONNECTING MATERIAL AND STRUCTURE FOR CONNECTING CIRCUIT MEMBER 审中-公开施瓦茨保加利亚革命妇女组织维也纳爱尔兰律师事务所
公开(公告)号：EP2222146A1
公开(公告)日：2010-08-25
申请号：EP08861615.6
申请日：2008-12-16
CPC分类号： H01R4/04 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/36 , C09J2205/102 , H01R12/52 , H01R12/7076 , H05K3/323 , H05K3/361 , H05K2203/1189
摘要： A circuit connecting material which is situated between mutually opposing circuit electrodes and, upon pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, the circuit connecting material having a laminated construction comprising an anisotropic conductive adhesive layer A with conductive particles 21 dispersed therein and an insulating adhesive layer B, wherein the adhesive force of the insulating adhesive layer B for glass substrates is greater than the adhesive force of the anisotropic conductive adhesive layer A for glass substrates.
摘要翻译： 位于相互相对的电路电极之间的电路连接材料，并且在按压相互相对的电路电极时沿着按压方向电连接电极，该电路连接材料具有包括各向异性导电粘合剂层A与导电粒子21的叠层结构 分散在其中并且绝缘粘合剂层B，其中用于玻璃基板的绝缘粘合剂层B的粘合力大于玻璃基板的各向异性导电粘合剂层A的粘合力。
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2.发明公开CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE 审中-公开SCHALTUNGSVERBINDUNGSMATIIAL UND SCHALTUNGSANSCHLUSSVERBINDUNGSSTRUKTUR
公开(公告)号：EP2211596A1
公开(公告)日：2010-07-28
申请号：EP08835704.1
申请日：2008-09-29
CPC分类号： H01R4/04 , C08G18/3256 , C08G18/4213 , C08G18/4277 , C08G18/672 , C08G18/718 , C08G18/755 , C08G18/7671 , C08K5/29 , C08L63/00 , C08L75/16 , C08L79/08 , C08L2205/02 , C08L2666/20 , C09J163/00 , C09J175/06 , H05K3/323 , H05K3/361 , C08G18/42
摘要： The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance.
Wherein R represents an organic group, R 1 and R 2 each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R 1 and R 2 may be linked together to form a cycloalkyl group.摘要翻译： 本发明的电路连接材料是一种电路连接材料，用于在具有形成在第一板的主侧上的第一电路电极的第一电路元件和形成在主体上的第二电路电极的第二电路元件之间连接 所述第一电路电极和所述第二电路电极彼此面对，所述电路连接材料包括成膜材料，加热时产生自由基的固化剂，自由基聚合物质， 含异氰酸酯基的化合物和由以下通式（I）表示的含有酮亚胺基的化合物，其中含异氰酸酯基的化合物含量为0.1-5重量份，含有酮亚胺基的化合物含量为0.1-5重量份 相对于作为成膜材料和自由基聚合物质的总量的100重量份。 其中R表示有机基团，R 1和R 2各自表示C1-C4单价脂族烃基，R 1和R 2可以连接在一起形成环烷基。
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3.发明公开CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE 审中-公开KLEBFILMFÜRSCHALTKREISVERBINDUNG UND STRUKTURFÜRSCHALTKREISVERBINDUNG
公开(公告)号：EP2237650A1
公开(公告)日：2010-10-06
申请号：EP08839429.1
申请日：2008-10-08
CPC分类号： H05K3/323 , H05K2201/0133 , H05K2201/0212 , Y10T428/28
摘要： A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive.
摘要翻译： 连接粘合膜的电路，其包含绝缘粘合剂，导电颗粒和含有聚酰胺基弹性体和/或聚酯类弹性体的颗粒非导电相，其中导电颗粒和非导电相分散在绝缘粘合剂中。
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4.发明公开CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL 审中-公开电路连接材料和电路元件的连接结构的电路元件的连接方法在电路连接材料的基
公开(公告)号：EP2178094A1
公开(公告)日：2010-04-21
申请号：EP08791996.5
申请日：2008-07-31
发明人： TOMISAKA, Katsuhiko , KOBAYASHI, Kouji , TAKETATSU, Jun , ARIFUKU, Motohiro , KOJIMA, Kazuyoshi , MOCHIZUKI, Nichiomi
IPC分类号： H01B1/22 , C09J5/00 , C09J9/02 , C09J11/04 , C09J163/00 , H01B1/00 , H01L21/60 , H01R11/01 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm 2 .
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5.发明授权CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104B1
公开(公告)日：2012-01-18
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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6.发明公开CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER 审中-公开VERBINDUNGSSTRUKTURFÜREIN SCHALTKREISELEMENT SCHALTKREISVERBINDUNGSMATERIAL
公开(公告)号：EP2148393A1
公开(公告)日：2010-01-27
申请号：EP08752686.9
申请日：2008-05-14
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01B1/02 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R12/714 , H01R13/03 , H05K3/361 , H05K2201/0221 , Y10T428/2998 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.
摘要翻译： 一种电路连接材料，用于将两个电路部件与其上形成有电路电极的电连接，电路电极相对，其中电路连接材料包括粘合剂组合物和导电颗粒，并且导电颗粒是具有多个突起 由表面上由包含由镍或镍合金构成的金属层覆盖的有机高分子化合物制成的芯构成，芯的平均粒径为1-4μm，金属层的厚度为65〜 125 nm。
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7.发明公开CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件的连接结构及方法将电路连接链接
公开(公告)号：EP2046104A1
公开(公告)日：2009-04-08
申请号：EP06768353.2
申请日：2006-07-21
发明人： ARIFUKU, Motohiro , MOCHIZUKI, Nichiomi , NAKAZAWA, Takashi , KOBAYASHI, Kouji , FUJINAWA, Tohru , TATSUZAWA, Takashi
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于电路部件各自具有一个基板和形成在所述基板的主表面上的电路电极，响应于光或热，以及含有氨基甲酸乙酯基团和酯有机化合物的粘合剂组合物，其包含没固化之间连接的电路连接材料 组。
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8.发明公开ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER 审中-公开HAFTMASSE，SCHALTKREISVERBINDENDES材料SOWIE VERBINDUNGSSTRUKTUR EINES SCHALTKREISELEMENTS
公开(公告)号：EP1967564A1
公开(公告)日：2008-09-10
申请号：EP06834683.2
申请日：2006-12-14
IPC分类号： C09J201/00 , C09J7/00 , H01B1/22 , H01L21/60 , H05K1/14
CPC分类号： H05K3/323 , C08K3/04 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29393 , H01L2224/29499 , H01L2224/32225 , H01L2224/83101 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K2201/0209 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.
摘要翻译： 一种粘合剂组合物，包括：粘合剂组分，导电颗粒和绝缘颗粒，其中绝缘颗粒Ri的平均粒度与导电颗粒Rc（R i / R c）的平均粒度之比为120至300％。
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公开(公告)号：EP2205052A1
公开(公告)日：2010-07-07
申请号：EP08710856.9
申请日：2008-02-06
IPC分类号： H05K3/36
CPC分类号： H05K3/361 , H05K3/28 , H05K3/323 , H05K2201/0191 , H05K2203/0594 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection.
The circuit connecting method comprises a step of preparing a circuit member 12 having circuit electrodes 12b formed on a glass substrate 12a, a step of preparing a flexible wiring board 14 having circuit electrodes 14b formed on a base 14a and provided with a solder resist 18 at the sections of the circuit electrodes 14b other than the sections that are connected to the circuit electrodes 12b, and a step of bonding the circuit member 12 to the flexible wiring board 14 via an anisotropic conductive film for circuit connection 16 so that part of the anisotropic conductive film for circuit connection 16 overlaps with part of the solder resist 18. The thickness h3 of the anisotropic conductive film for circuit connection 16 is no greater than the total of the height h1 of the circuit electrodes 12b and the height h2 of the circuit electrodes 14b.摘要翻译： 本发明提供一种电路连接方法，其可以令人满意地减小经由用于电路连接的各向异性导电膜电连接的电路电极之间的连接电阻。 电路连接方法包括准备具有形成在玻璃基板12a上的电路电极12b的电路部件12的步骤，准备柔性布线基板14的步骤，该柔性布线基板14具有形成在基座14a上的电路电极14b，并设置有阻焊剂18 除了连接到电路电极12b的部分之外的电路电极14b的部分，以及通过用于电路连接16的各向异性导电膜将电路部件12接合到柔性布线板14的步骤，使得部分各向异性 用于电路连接的导电膜16与阻焊剂18的一部分重叠。用于电路连接16的各向异性导电膜的厚度h3不大于电路电极12b的高度h1和电路电极的高度h2的总和 14B。
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10.发明公开
公开(公告)号：EP2157146A1
公开(公告)日：2010-02-24
申请号：EP07745185.4
申请日：2007-06-13
CPC分类号： H05K3/323 , H01R4/04 , H01R12/52 , H05K2201/0133
摘要： A film-like adhesive for circuit connection which is situated between mutually opposing circuit electrodes and, upon heating and pressing the mutually opposing circuit electrodes, electrically connects the electrodes in the pressing direction, characterized in that the water contact angle of the adhesive after curing is 90° or greater.
摘要翻译： 电路连接用薄膜状粘接剂，位于相互相对的电路电极之间，加热并压制相互对置的电路电极时，沿着按压方向电连接电极，其特征在于，固化后的粘接剂的水接触角为 90°以上。
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