Invention Patent
- Patent Title: A method of manufacturing a semiconductor device
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Application No.: JP2004354768Application Date: 2004-12-08
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Publication No.: JP4834304B2Publication Date: 2011-12-14
- Inventor: 進 弘 安 , 聖 彦 朴 , 相 敦 李 , 俊 熙 趙 , 一 旭 金
- Applicant: 株式会社ハイニックスセミコンダクターHynix Semiconductor Inc.
- Assignee: 株式会社ハイニックスセミコンダクターHynix Semiconductor Inc.
- Current Assignee: 株式会社ハイニックスセミコンダクターＨｙｎｉｘ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｉｎｃ．
- Priority: KR20040046316 2004-06-21
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/3065 ; H01L21/308 ; H01L21/311 ; H01L21/336 ; H01L21/76 ; H01L21/762 ; H01L21/763 ; H01L21/764 ; H01L21/765 ; H01L21/8234 ; H01L21/8242 ; H01L27/02 ; H01L29/00 ; H01L29/06
Public/Granted literature
- JP2006013422A Semiconductor device and its manufacturing method Public/Granted day:2006-01-12
Information query
IPC分类:
