一种电子封装结构，系包括：承载件、设于该承载件上之电子组件与复数导电组件、结合至该些导电组件上之金属架、以及形成于该承载件与该金属架上且包覆该电子组件与该些导电组件之包覆层，且借由该金属架外露于该包覆层以作为电性接点，而使用共享模压模具形成该包覆层即可，故无需配合该电子封装结构之尺寸使用特定尺寸之模压模具，因而能降低生产成本。本发明复提供该电子封装结构之制法。

Provided is an electronic package structure, comprising a carrier member, an electronic component and a plurality of conductive elements disposed on the carrier member, a metallic frame connected to the conductive elements, and an encapsulating layer formed on the carrier member and the metallic frame for covering the electronic component and the conductive elements in such a way that the metallic frame is exposed from the encapsulating layer to serve as electrical connecting points, and the encapsulating layer can be formed by the commonly shared mold without using specific sizes in order to accommodate the size of the package structure to thereby save manufacturing costs. The invention further provides a method for manufacturing the electronic package structure as described above.