- 专利标题: Perpendicular magnetic tunneling junction (MTJ) for improved magnetoresistive random-access memory (MRAM) process
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申请号: US14645683申请日: 2015-03-12
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公开(公告)号: US10008662B2公开(公告)日: 2018-06-26
- 发明人: Wen-Chun You , Kuo-Chi Tu , Chih-Yang Chang , Hsia-Wei Chen , Chin-Chieh Yang , Sheng-Hung Shih , Wen-Ting Chu , Yu-Wen Liao
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Eschweiler & Potashnik, LLC
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L43/08 ; H01L43/12 ; H01L27/22
摘要:
A method of forming a magnetoresistive random access memory (MRAM) device including a perpendicular MTJ (magnetic tunnel junction) is provided. The method includes forming a magnetic tunneling junction (MTJ) over a bottom electrode layer. A top electrode layer is formed over an upper surface of the MTJ, and a hard mask is formed over an upper surface of the top electrode layer. A first etch is performed through the top electrode layer, through regions of the MTJ unmasked by the hard mask, to form a top electrode and an etched MTJ. Sidewall spacers are formed extending from an upper surface of the hard mask or the top electrode, along sidewalls of the top electrode and the etched MTJ, to a point below or about even with an upper surface of the bottom electrode. A resulting MRAM device structure is also provided.
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