Invention Grant
- Patent Title: Semiconductor memory device, erasing method and programing method thereof
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Application No.: US15239763Application Date: 2016-08-17
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Publication No.: US10026482B2Publication Date: 2018-07-17
- Inventor: Kazuki Yamauchi
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: JP2016-022322 20160209
- Main IPC: G11C16/14
- IPC: G11C16/14 ; G06F11/10 ; G11C16/26 ; G11C16/34 ; G11C29/44 ; G11C16/10 ; G11C16/16 ; G11C16/04 ; G11C29/52 ; G11C7/20 ; G11C29/42 ; G11C29/04

Abstract:
A semiconductor memory device, an erasing method and a programming method are provided. The semiconductor memory device includes a memory array, which includes a plurality of NAND strings; a page buffer/sensing circuit, which is connected to the NAND strings of the memory array through bit lines and outputs whether the NAND strings include failures; and a detecting circuit, which is connected to the plurality of page buffer/sensing circuits and detects a number of the failures among the NAND strings of a selected block. The block is determined to be usable when the number of the failures among the NAND strings detected by the detecting circuit is less than or equal to a fixed number, and the block is determined to be unusable as a bad block when the number of the failures exceeds the fixed number.
Public/Granted literature
- US20170229184A1 SEMICONDUCTOR MEMORY DEVICE, ERASING METHOD AND PROGRAMING METHOD THEREOF Public/Granted day:2017-08-10
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