Invention Grant
- Patent Title: Fluid flow channel for enhanced heat transfer efficiency
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Application No.: US14446123Application Date: 2014-07-29
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Publication No.: US10030916B2Publication Date: 2018-07-24
- Inventor: Phi Hung Thanh , Paul J. Diglio , John C. Johnson , Jarett L. Rinaldi , Arnab Choudhury
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28F1/10 ; F28F3/12 ; F28F13/06 ; H01L23/473

Abstract:
A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.
Public/Granted literature
- US20160033208A1 Fluid Flow Channel For Enhanced Heat Transfer Efficiency Public/Granted day:2016-02-04
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