Invention Grant
- Patent Title: Organic semiconductor composition and method for manufacturing organic semiconductor element
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Application No.: US15648463Application Date: 2017-07-13
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Publication No.: US10074813B2Publication Date: 2018-09-11
- Inventor: Yosuke Yamamoto , Yushi Hongo , Kensuke Masui
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2015-053206 20150317
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00 ; C07D495/22 ; H01L29/786 ; H01L51/05 ; C09D11/03 ; C09D11/033 ; C09D11/102 ; C09D11/36 ; C09D11/38 ; C09D11/52
Abstract:
An object of the present invention is to provide an organic semiconductor composition, which makes it possible to obtain an organic semiconductor film having high mobility and being excellent in film uniformity and heat resistance, and a method for manufacturing an organic semiconductor element.The organic semiconductor composition of the present invention contains an organic semiconductor as Component A and an organic solvent, which is represented by Formula B-1 and has a melting point of equal to or lower than 25° C. and a boiling point of equal to or higher than 150° C. and equal to or lower than 280° C., as Component B, in which an ionization potential of Component A is equal to or higher than 5.1 eV. In the formula, X represents O, S, S═O, O═S═O, or NR, Y1 to Y4 each independently represent NR1 or CR10R11, R, R1, R10, and R11 each independently represent a hydrogen atom or a substituent, and n represents 1 or 2.
Public/Granted literature
- US20170317296A1 ORGANIC SEMICONDUCTOR COMPOSITION AND METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT Public/Granted day:2017-11-02
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