Invention Grant
- Patent Title: Polishing composition and polishing method
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Application No.: US15514130Application Date: 2015-08-28
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Publication No.: US10093834B2Publication Date: 2018-10-09
- Inventor: Yasuto Ishida
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-Shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2014-197860 20140929
- International Application: PCT/JP2015/004378 WO 20150828
- International Announcement: WO2016/051659 WO 20160407
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14 ; H01L21/321 ; H01L21/3105
Abstract:
There are provided a polishing composition and a method for polishing capable of, when a substrate including polysilicon is polished, limiting the polishing rate of the polysilicon, and selectively polishing a silicon compound other than the polysilicon, such as silicon nitride. The polishing composition used includes abrasives, an organic acid and a conjugate base of the organic acid.
Public/Granted literature
- US20170298253A1 POLISHING COMPOSITION AND POLISHING METHOD Public/Granted day:2017-10-19
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