Invention Grant
- Patent Title: Substrate or panel with releasable core
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Application No.: US15289309Application Date: 2016-10-10
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Publication No.: US10098233B2Publication Date: 2018-10-09
- Inventor: Ravi Shankar , Ching-Ping Janet Shen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K3/00 ; H05K3/02 ; B32B37/12 ; B32B37/24 ; B32B37/26 ; B32B38/10 ; H01L21/465 ; H01L21/683 ; B32B7/12 ; B32B17/06 ; B32B27/38 ; B32B15/04 ; B32B15/08 ; B32B15/20 ; B32B27/20 ; B32B27/28 ; B32B3/30 ; B32B5/02 ; B32B15/14 ; H01L21/48 ; H01L23/498

Abstract:
Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.
Public/Granted literature
- US20170021605A1 SUBSTRATE OR PANEL WITH RELEASABLE CORE Public/Granted day:2017-01-26
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