公开(公告)号：US10398033B2

公开(公告)日：2019-08-27

申请号：US15453368

申请日：2017-03-08

Applicant: Intel Corporation

Inventor： Ravi Shankar ,  Ching-Ping Janet Shen

IPC: B32B3/30 ,  B32B5/02 ,  B32B7/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  B32B15/04 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/06 ,  B32B27/20 ,  B32B27/28 ,  B32B27/38 ,  B32B37/12 ,  B32B37/24 ,  B32B37/26 ,  B32B38/10 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498

Abstract: Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

公开(公告)号：US20150174859A1

公开(公告)日：2015-06-25

申请号：US14227750

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Jean-Marie Erie ,  Ravi Shankar ,  Ching-Ping Janet Shen ,  Rose Mulligan

IPC: B32B15/04 ,  B32B15/20 ,  B32B9/04 ,  B32B9/00 ,  H01L21/683 ,  B32B7/12

CPC classification number: B32B15/20 ,  B32B7/12 ,  B32B15/092 ,  B32B27/20 ,  B32B2250/40 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/6836 ,  Y10T156/10 ,  Y10T428/24752 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个示例，制造可释放的核心面板的技术可以包括（1）在面板的中心部分上布置面罩，所述面板包括中心加强件，第一薄片通过第一和第二薄片附接到中心加强件的第一侧 粘合剂层和通过第二粘合剂层附接到中心加强件的第二侧的第二箔，中心加强件的第一侧与中心加强件的第二侧相对，（2）去除面板的暴露边缘的部分，以及 （3）去除面膜。

公开(公告)号：US11156815B2

公开(公告)日：2021-10-26

申请号：US16336607

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu ,  Anna M. Prakash ,  Amanuel M Abebaw ,  Olga Gorbounova ,  Ching-Ping Janet Shen ,  Shan Zhong ,  Mark Saltas

IPC: G02B19/00 ,  G01J1/04

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesive layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.

公开(公告)号：US20170202080A1

公开(公告)日：2017-07-13

申请号：US15413156

申请日：2017-01-23

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Ravi Shankar ,  Yonggang Li ,  Dilan Seneviratne ,  Charan K. Gurumurthy

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  H05K1/03 ,  H05K3/20 ,  H05K1/18 ,  H05K3/28 ,  B23K1/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/38 ,  B32B3/30 ,  H05K3/10

CPC classification number: H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K2101/42 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/283 ,  B32B27/38 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2419/00 ,  B32B2457/08 ,  B32B2607/00 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/183 ,  H05K3/022 ,  H05K3/10 ,  H05K3/107 ,  H05K3/202 ,  H05K3/284 ,  H05K3/386 ,  H05K2201/09036 ,  Y10T29/49124 ,  Y10T428/24851

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

公开(公告)号：US09554472B2

公开(公告)日：2017-01-24

申请号：US14227723

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Ravi Shankar ,  Yonggang Li ,  Dilan Seneviratne ,  Charan K. Gurumurthy

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/10 ,  H05K1/18 ,  B23K1/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/28 ,  B32B27/38 ,  H05K3/02 ,  H05K3/38 ,  H05K3/28

CPC classification number: H05K1/0271 ,  B23K1/0008 ,  B23K1/0016 ,  B23K2101/42 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/283 ,  B32B27/38 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2419/00 ,  B32B2457/08 ,  B32B2607/00 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K1/183 ,  H05K3/022 ,  H05K3/10 ,  H05K3/107 ,  H05K3/202 ,  H05K3/284 ,  H05K3/386 ,  H05K2201/09036 ,  Y10T29/49124 ,  Y10T428/24851

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基本上矩形的基部，使用结合材料来定位位于内箔上的外导电箔或者使用连接材料，内箔和外导电 在外导电箔和内箔的边缘附近箔。

公开(公告)号：US09522514B2

公开(公告)日：2016-12-20

申请号：US14135168

申请日：2013-12-19

Applicant: Intel Corporation

Inventor： Ravi Shankar ,  Ching-Ping Janet Shen

IPC: B32B7/12 ,  B32B17/06 ,  B32B27/38 ,  B32B38/10 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  H05K3/02 ,  B32B37/24 ,  B32B37/26 ,  H05K3/00

CPC classification number: H05K3/025 ,  B32B3/30 ,  B32B5/02 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/06 ,  B32B27/20 ,  B32B27/283 ,  B32B27/38 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/748 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2383/00 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K1/038 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/022 ,  H05K2203/06 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24942

Abstract: Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

Abstract translation: 这里通常讨论的是可以包括其中具有一个或多个凹部的底座的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个示例，制造可释放的芯板的技术可以包括提供可释放的芯，所述可释放的芯包括在所述基底的第一侧和所述导电箔的第一侧与所述基底整体耦合的第一导电箔，所述第一 导电箔位于基座的第一侧的第一凹部中。 该技术可以包括将第二导电箔可释放地耦合到第一导电箔的第二侧，通过一体耦合到第二导电箔的第一侧的临时粘合剂层，第一导电箔的与第一导电箔的第一侧相对的第二侧 第一导电箔。

公开(公告)号：US20170181290A1

公开(公告)日：2017-06-22

申请号：US15453368

申请日：2017-03-08

Applicant: Intel Corporation

Inventor： Ravi Shankar ,  Ching-Ping Janet Shen

IPC: H05K3/02 ,  H05K1/09 ,  H05K1/03 ,  H01L21/683 ,  H01L21/48 ,  B32B37/12 ,  B32B15/04 ,  B32B3/30 ,  B32B15/20 ,  B32B15/14 ,  B32B5/02 ,  B32B38/10 ,  H01L23/498 ,  B32B7/12

CPC classification number: H05K3/025 ,  B32B3/30 ,  B32B5/02 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/06 ,  B32B27/20 ,  B32B27/283 ,  B32B27/38 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/748 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2383/00 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K1/038 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/022 ,  H05K2203/06 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24942

Abstract: Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

公开(公告)号：US20170021605A1

公开(公告)日：2017-01-26

申请号：US15289309

申请日：2016-10-10

Applicant: Intel Corporation

Inventor： Ravi Shankar ,  Ching-Ping Janet Shen

IPC: B32B38/10 ,  H05K3/02 ,  B32B15/08 ,  B32B15/20 ,  B32B7/12 ,  B32B15/04

CPC classification number: H05K3/025 ,  B32B3/30 ,  B32B5/02 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B17/06 ,  B32B27/20 ,  B32B27/283 ,  B32B27/38 ,  B32B37/12 ,  B32B38/10 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/748 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2383/00 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K1/038 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/022 ,  H05K2203/06 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24942

Abstract: Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

Abstract translation: 这里通常讨论的是可以包括其中具有一个或多个凹部的底座的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个示例，制造可释放的芯板的技术可以包括提供可释放的芯，所述可释放的芯包括在所述基底的第一侧和所述导电箔的第一侧与所述基底整体耦合的第一导电箔，所述第一 导电箔位于基座的第一侧的第一凹部中。 该技术可以包括将第二导电箔可释放地耦合到第一导电箔的第二侧，通过一体耦合到第二导电箔的第一侧的临时粘合剂层，第一导电箔的与第一导电箔的第一侧相对的第二侧 第一导电箔。

公开(公告)号：US09434135B2

公开(公告)日：2016-09-06

申请号：US14227750

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Jean-Marie Erie ,  Ravi Shankar ,  Ching-Ping Janet Shen ,  Rose Mulligan

IPC: B32B7/12 ,  B32B15/20 ,  H01L21/683 ,  B32B15/092 ,  B32B27/20

CPC classification number: B32B15/20 ,  B32B7/12 ,  B32B15/092 ,  B32B27/20 ,  B32B2250/40 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/6836 ,  Y10T156/10 ,  Y10T428/24752 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/30 ,  Y10T428/31678

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include (1) arranging a mask on a center portion of the panel, the panel including a center stiffener with a first foil attached to a first side of the center stiffener by a first adhesive layer and a second foil attached to a second side of the center stiffener by a second adhesive layer, the first side of the center stiffener opposite the second side of the center stiffener, (2) removing portions of exposed edges of the panel, and (3) removing the mask.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个示例，制造可释放的核心面板的技术可以包括（1）在面板的中心部分上布置面罩，所述面板包括中心加强件，第一薄片通过第一和第二薄片附接到中心加强件的第一侧 粘合剂层和通过第二粘合剂层附接到中心加强件的第二侧的第二箔，中心加强件的第一侧与中心加强件的第二侧相对，（2）去除面板的暴露边缘的部分，以及 （3）去除面膜。

公开(公告)号：US20200073099A1

公开(公告)日：2020-03-05

申请号：US16336607

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu ,  Anna M. Prakash ,  Amanuel M. Abebaw ,  Olga Gorbounova ,  Ching-Ping Janet Shen ,  Shan Zhong ,  Mark Saltas

IPC: G02B19/00 ,  G01J1/04

Abstract: Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.