- 专利标题： Peeling method using separating peeling layer and layer to be peeled
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申请号： US15252295申请日： 2016-08-31
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公开(公告)号： US10141526B2公开(公告)日： 2018-11-27
- 发明人: Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
- 申请人： Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址： JP Atsugi-shi, Kanagawa-ken
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi, Kanagawa-ken
- 代理机构： Fish & Richardson P.C.
- 优先权： JP2014-029756 20140219
- 主分类号： H01L51/00
- IPC分类号： H01L51/00 ; B32B7/02 ; B32B37/02 ; B32B37/18 ; B32B38/10 ; B32B7/12 ; B32B15/08 ; B32B15/18 ; B32B15/20 ; B32B17/00 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B7/06 ; B32B17/06 ; B32B37/10 ; B32B37/12 ; H01L51/52
摘要：
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
公开/授权文献
- US20170092885A1 LIGHT-EMITTING DEVICE AND PEELING METHOD 公开/授权日：2017-03-30
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