Invention Grant
- Patent Title: Link-physical layer interface adapter
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Application No.: US15283309Application Date: 2016-10-01
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Publication No.: US10152446B2Publication Date: 2018-12-11
- Inventor: Venkatraman Iyer , Mahesh Wagh , William R. Halleck , Rahul R. Shah
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F13/36 ; G06F13/40 ; G06F13/42 ; G11C27/04

Abstract:
An interface adapter to identify a first ready signal from a first link layer-to-physical layer (LL-PHY) interface of a first communication protocol indicating readiness of a physical layer of the first protocol to accept link layer data. The interface adapter generates a second ready signal compatible with a second LL-PHY interface of a second communication protocol to cause link layer data to be sent from a link layer of the second communication protocol according to a predefined delay. A third ready signal is generated compatible with the first LL-PHY interface to indicate to the physical layer of the first communication protocol that the link layer data is to be sent. The interface adapter uses a shift register to cause the link layer data to be passed to the physical layer according to the predefined delay.
Public/Granted literature
- US20180095923A1 LINK-PHYSICAL LAYER INTERFACE ADAPTER Public/Granted day:2018-04-05
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