Invention Grant
- Patent Title: Substrate liquid processing apparatus and substrate liquid processing method
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Application No.: US14536989Application Date: 2014-11-10
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Publication No.: US10162371B2Publication Date: 2018-12-25
- Inventor: Yasuhiro Takaki , Hiroshi Komiya , Chikara Nobukuni , Keigo Satake , Atsushi Anamoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2013-235304 20131113; JP2014-205113 20141003
- Main IPC: B01F15/00
- IPC: B01F15/00 ; B01F3/08 ; G05D11/13

Abstract:
A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.
Public/Granted literature
- US20150131403A1 SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD Public/Granted day:2015-05-14
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