Invention Grant
- Patent Title: Semiconductor structures having low resistance paths throughout a wafer
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Application No.: US15425005Application Date: 2017-02-06
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Publication No.: US10177000B2Publication Date: 2019-01-08
- Inventor: Jeffrey P. Gambino , Thomas J. Hartswick , Zhong-Xiang He , Anthony K. Stamper , Eric J. White
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/288 ; H01L21/768 ; H01L23/522 ; H01L23/00 ; H01L23/485 ; H01L23/532 ; H01L21/3205 ; H01L21/285 ; H01L23/58 ; H01L23/528 ; C25D7/12 ; C25D3/38 ; C25D5/10
Abstract:
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low resistance conduction path on a wafer, and forming an electroplated seed layer in direct contact with the low resistance conduction path.
Public/Granted literature
- US20170148672A1 SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER Public/Granted day:2017-05-25
Information query
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