Invention Grant
- Patent Title: Laser processing of sapphire substrate and related applications
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Application No.: US15585305Application Date: 2017-05-03
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Publication No.: US10179748B2Publication Date: 2019-01-15
- Inventor: Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kevin L. Bray
- Main IPC: B32B3/00
- IPC: B32B3/00 ; C03B33/02 ; B32B17/06 ; B23K26/53 ; B23K26/55 ; B23K26/06 ; B23K26/073 ; B23K26/00 ; B23K26/0622 ; B23K26/40 ; B23K103/00

Abstract:
A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
Public/Granted literature
- US20170291844A1 LASER PROCESSING OF SAPPHIRE SUBSTRATE AND RELATED APPLICATIONS Public/Granted day:2017-10-12
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