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公开(公告)号：US11773004B2
公开(公告)日：2023-10-03
申请号：US15560390
申请日：2016-03-23
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Xinghua Li , Sasha Marjanovic , Moussa N'Gom , David Andrew Pastel , Garrett Andrew Piech , Daniel Schnitzler , Robert Stephen Wagner , James Joseph Watkins
IPC: C03B33/02 , B23K26/364 , C03C3/093 , B23K26/53 , B23K103/00
CPC classification number: C03B33/0222 , B23K26/364 , B23K26/53 , C03B33/0215 , C03C3/093 , B23K2103/54 , Y02P40/57
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US10392290B2
公开(公告)日：2019-08-27
申请号：US15662788
申请日：2017-07-28
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B23/02 , C03B33/09 , C03B33/02 , C03B33/08 , C03B33/10 , B23K26/359 , C03B33/033 , C03B23/023 , C03B23/025 , B23K26/402 , B23K26/0622 , B23K26/53 , B23K26/08 , B23K103/00 , B23K103/16 , C03B33/023 , C03B33/04
Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
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公开(公告)号：US20170239748A1
公开(公告)日：2017-08-24
申请号：US15496428
申请日：2017-04-25
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Kamjula Pattabhirami Reddy , Pushkar Tandon , Sergio Tsuda , Natesan Venkataraman , Robert Stephen Wagner
IPC: B23K26/00 , C03B25/087 , B23K26/0622 , C03B33/09 , B23K26/53 , C03B33/02 , C03B33/07
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/402 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2103/166 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B32B7/02 , B32B17/00 , B32B2457/20 , C03B17/02 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.
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公开(公告)号：US20170225996A1
公开(公告)日：2017-08-10
申请号：US15496393
申请日：2017-04-25
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Kamjula Pattabhirami Reddy , Pushkar Tandon , Sergio Tsuda , Natesan Venkataraman , Robert Stephen Wagner
IPC: C03B33/02 , C03B25/087 , C03B33/07 , B23K26/53 , B23K26/00 , B23K26/0622 , B23K26/402 , C03B17/06 , C03B33/09
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/402 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2103/166 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B32B7/02 , B32B17/00 , B32B2457/20 , C03B17/02 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.
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公开(公告)号：US09701563B2
公开(公告)日：2017-07-11
申请号：US14530244
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Kamjula Pattabhirami Reddy , Pushkar Tandon , Sergio Tsuda , Natesan Venkataraman , Robert Stephen Wagner
IPC: C03B33/02 , C03B17/00 , B32B17/00 , B32B7/02 , C03B25/087 , C03B29/10 , B23K26/0622 , B23K26/00 , B23K26/402 , B23K26/57 , B23K26/53 , B23K26/55 , C03B33/07 , C03B33/09 , C03B17/02 , C03B17/06 , B23K103/16 , B23K103/00
CPC classification number: B23K26/0057 , B23K26/0006 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/402 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B32B7/02 , B32B17/00 , B32B2457/20 , C03B17/02 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/0222 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.
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Patent Agency Ranking
公开(公告)号：US20170001900A1
公开(公告)日：2017-01-05
申请号：US15114236
申请日：2015-01-27
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , David Andrew Pastel , Garrett Andrew Piech , Jose Mario Quintal , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner , Andrea Nicole Yeary
IPC: C03B33/02 , C03C21/00 , B23K26/402 , B23K26/08 , B23K26/0622 , B23K26/362
Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
Abstract translation: 本文描述了使用激光器对任意形状的玻璃基板的边缘进行倒角和/或斜切的工艺。 在玻璃基板上生产倒角的两种一般方法是首先采用超短脉冲激光切割具有期望的倒角形状的边缘，以在玻璃内产生穿孔; 然后进行离子交换。
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公开(公告)号：US20150166397A1
公开(公告)日：2015-06-18
申请号：US14529801
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: B23K26/53 , B23K26/0624 , B23K26/382 , C03B33/0222 , Y02P40/57
Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.
Abstract translation: 用于激光钻孔材料的系统包括被配置为产生波长小于或等于约850nm的脉冲激光束的脉冲激光器，所选择的波长使得材料在该波长处基本上是透明的。 该系统还包括位于激光束的光束路径中的光学组件，其配置成在光学组件的光束出射侧将激光束转换成沿光束传播方向定向的激光束焦点。
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8.发明申请METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM 审中-公开用于激光激光玻璃中的孔的方法和其制造的产品公开(公告)号：US20150166396A1
公开(公告)日：2015-06-18
申请号：US14535800
申请日：2014-11-07
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US20240116140A1
公开(公告)日：2024-04-11
申请号：US18374068
申请日：2023-09-28
Applicant: CORNING INCORPORATED
Inventor： Sterling Michael Clarke , Reinhard Moritz Malchus , Sasha Marjanovic , Garrett Andrew Piech , Alranzo Boh Ruffin , Sergio Tsuda
CPC classification number: B23K26/53 , B23K26/40 , B23K2103/54
Abstract: A method of processing a transparent workpiece comprises directing a defect-forming laser beam to an impingement surface of a transparent workpiece, the defect-forming laser beam having a numerical aperture from 0.10 to 0.25, the transparent workpiece having a textured surface, the textured surface having an Ra value of greater than or equal to 0.5 μm.
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公开(公告)号：US11148225B2
公开(公告)日：2021-10-19
申请号：US16183065
申请日：2018-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/38 , C03B33/09 , C03C15/00 , B23K26/06 , B23K26/04 , C03B33/02 , B32B17/06 , B23K26/0622 , B23K26/53 , B23K26/402 , C03C17/00 , B23K26/55 , C09K13/00 , B32B17/10 , B23K103/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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