Invention Grant
- Patent Title: Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
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Application No.: US15631006Application Date: 2017-06-23
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Publication No.: US10199372B2Publication Date: 2019-02-05
- Inventor: Ingo Muri , Iris Moder , Oliver Hellmund , Johannes Baumgartl , Annette Saenger , Barbara Eichinger , Doris Sommer , Jacob Tillmann Ludwig
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94 ; H01L29/76 ; H01L27/06 ; H01L23/48 ; H01L21/768
Abstract:
An integrated circuit device including a chip die having a first area with a first thickness surrounding a second area with a second thickness, the first thickness is greater than the second thickness, the chip die having a front-side and a back-side, at least one passive electrical component provided at least one of in or over the chip die in the first area on the front-side, and at least one active electrical component provided at least one of in or over the chip die in the second area on the front-side.
Public/Granted literature
Information query
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