Invention Grant
- Patent Title: Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
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Application No.: US14647365Application Date: 2014-08-05
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Publication No.: US10202525B2Publication Date: 2019-02-12
- Inventor: Sang Min Park , Yoon Gyung Cho , Kyung Yul Bae , Hyun Jee Yoo , Jung Sup Shim , Min Soo Park
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2013-0092782 20130805; KR10-2014-0040816 20140404
- International Application: PCT/KR2014/007244 WO 20140805
- International Announcement: WO2015/020413 WO 20150212
- Main IPC: H01L51/00
- IPC: H01L51/00 ; C09J109/00 ; H01L51/56 ; H01L51/52 ; C09J9/00 ; C09J4/00 ; C09J7/00 ; C09J123/22 ; C09J133/08 ; C09J145/00 ; C09J7/20 ; C09J7/10
Abstract:
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Public/Granted literature
Information query
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