Invention Grant
- Patent Title: Method for high throughput using beam scan size and beam position in gas cluster ion beam processing system
-
Application No.: US15266639Application Date: 2016-09-15
-
Publication No.: US10256095B2Publication Date: 2019-04-09
- Inventor: Soo Doo Chae , Noel Russell , Joshua LaRose , Nicholas Joy , Luis Fernandez , Allen J. Leith , Steven P. Caliendo , Yan Shao , Vincent Lagana-Gizzo
- Applicant: TEL Epion Inc.
- Applicant Address: US MA Billerica
- Assignee: TEL Epion Inc.
- Current Assignee: TEL Epion Inc.
- Current Assignee Address: US MA Billerica
- Agency: Wood Herron & Evans LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/66 ; G05B19/406 ; H01L21/265 ; H01L21/263 ; H01J37/304
Abstract:
A system and method for performing location specific processing of a workpiece is described. The method includes placing a microelectronic workpiece in a beam processing system, selecting a beam scan size for a beam scan pattern that is smaller than a dimension of the microelectronic workpiece, generating a processing beam, and processing a target region of the microelectronic workpiece by irradiating the processing beam along the beam scan pattern onto the target region within the beam scan size selected for processing the microelectronic workpiece.
Public/Granted literature
- US20170077001A1 METHOD FOR HIGH THROUGHPUT USING BEAM SCAN SIZE AND BEAM POSITION IN BEAM PROCESSING SYSTEM Public/Granted day:2017-03-16
Information query
IPC分类:
